新能源汽车IGBT功率模块热管理的数值模拟

doi:10.3785/j.issn.1008-973X.2025.10.002

浙江大学学报(工学版)

2025, Vol. 59

Issue (10): 2014-2022 DOI: 10.3785/j.issn.1008-973X.2025.10.002

机械工程

新能源汽车IGBT功率模块热管理的数值模拟

高紫涵1,3(

),程豫洲2,王学合4,罗坤1,2,*(

),樊建人1,2

1. 浙江大学能源高效清洁利用全国重点实验室，浙江杭州 310027
2. 浙江大学上海高等研究院，上海 201203
3. 全省新能源车辆热管理重点实验室，浙江龙泉 323700
4. 上海芯华睿半导体科技有限公司，上海 201203

Numerical simulation of thermal management of IGBT power modules in new energy vehicles

Zihan GAO1,3(

),Yuzhou CHENG2,Xuehe WANG4,Kun LUO1,2,*(

),Jianren FAN1,2

1. State Key Laboratory of Clean Energy Utilization, Zhejiang University, Hangzhou 310027, China
2. Shanghai Institute for Advanced Study, Zhejiang University, Shanghai 201203, China
3. Provincial Key Laboratory of New Energy Vehicles Thermal Management, Longquan 323700, China
4. Shanghai SemiHua Semiconductor Technology Limited Company, Shanghai 201203, China

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摘要：

为了提升新能源汽车功率模块的散热能力，采用流热固耦合数值模拟方法分析绝缘栅双极型晶体管（IGBT）功率模块的热管理系统，并提出包含贡献量化、代理建模与整体优化的三阶段设计优化方法. 基于ANSYS Fluent软件建立IGBT功率模块的数值模型，数值模拟值与实验值的相对误差为3.7%. 对影响IGBT功率模块散热性能的主要因素（包括基板陶瓷材料、冷却液流量和针肋结构）进行分析，确定对流换热热阻和陶瓷层热阻是影响芯片热阻的主要因素. 通过代理模型构建与多目标优化对750 V/820 A H-Boost IGBT功率模块进行设计优化，优化后的功率模块芯片热阻降低了21.1%，压降减少了39.3%，模块质量减轻了6.1%.

关键词： 绝缘栅双极晶体管(IGBT); 热管理; 流热固耦合; 数值模拟; 设计优化

Abstract:

To improve the cooling performance of power modules in new energy vehicles, a fluid–thermal–solid coupling numerical method was used to analyze the thermal management of an insulated gate bipolar transistor (IGBT) power module. A three-stage design optimization method, including contribution quantification, surrogate modeling, and overall optimization, was proposed. A numerical model of the IGBT power module was established in ANSYS Fluent, and the resulting relative error between the simulation and the experimental data was 3.7%. The effects of substrate ceramic material, coolant flow rate, and Pin-Fin geometry on thermal performance were analyzed, showing that convective thermal resistance and ceramic layer resistance are the main factors affecting chip thermal resistance. Based on surrogate modeling and multi-objective optimization, the design of a 750 V/820 A H-Boost IGBT power module was optimized. The optimized design reduced chip thermal resistance by 21.1%, pressure drop by 39.3%, and module mass by 6.1%.

Key words: insulated gate bipolar transistor (IGBT) thermal management thermo-fluid-solid coupling numerical simulation design optimization

收稿日期: 2024-12-27 出版日期: 2025-10-27

CLC:

TM 46

基金资助: 国家自然科学基金资助项目（52236002）.

通讯作者: 罗坤 E-mail: 22327103@zju.edu.cn;zjulk@zju.edu.cn

作者简介: 高紫涵（2001—），女，硕士生，从事功率半导体热管理研究. orcid.org/0009-0006-0291-3403. E-mail：22327103@zju.edu.cn

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引用本文:

高紫涵,程豫洲,王学合,罗坤,樊建人. 新能源汽车IGBT功率模块热管理的数值模拟[J]. 浙江大学学报(工学版), 2025, 59(10): 2014-2022.

Zihan GAO,Yuzhou CHENG,Xuehe WANG,Kun LUO,Jianren FAN. Numerical simulation of thermal management of IGBT power modules in new energy vehicles. Journal of ZheJiang University (Engineering Science), 2025, 59(10): 2014-2022.

链接本文:

https://www.zjujournals.com/eng/CN/10.3785/j.issn.1008-973X.2025.10.002 或 https://www.zjujournals.com/eng/CN/Y2025/V59/I10/2014

图 1 H-Boost IGBT模块的结构示意图

图 2 IGBT功率模块的简化模型

表 1 IGBT功率模块的材料物性参数

图 3 IGBT功率模块的网格无关性验证

图 4 IGBT功率模块的网格分布示意图

图 5 IGBT功率模块的芯片表面温度分布

表 2 IGBT功率模块芯片的热阻测试结果

图 6 不同陶瓷基板的芯片热阻

图 7 不同材料的陶瓷基板温度分布

图 8 不同材料的陶瓷基板温度梯度分布

图 9 冷却液压降和芯片热阻随冷却液体积流量的变化

图 10 不同冷却液体积流量下的冷却液截面温度分布

图 11 针肋结构示意图

图 12 不同圆形针肋直径下的冷却液压降与芯片热阻

图 13 不同横向节距下的冷却液压降与芯片热阻

图 14 不同椭圆针肋长轴下的冷却液压降与芯片热阻

表 3 IGBT功率模块原始结构热阻与质量占比分析

表 4 陶瓷材料性能参数对比

图 15 不同目标参数模型预测结果与数值模拟计算结果的对比

表 5 针肋结构优化参数的对比

表 6 IGBT功率模块优化前后的参数对比

表 7 IGBT功率模块优化前后的性能对比

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