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Seepage experiment and numerical simulation based on microfluidic chip model |
Shao-kai NIE(),Peng-fei LIU,Te BA*(),Yun-min CHEN |
Institute of Geotechnical Engineering, Zhejiang University, Hangzhou 310058, China |
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Abstract Based on the microfluidic chip processing technology and using the microscopy-micromodel experimental system, the seepage experiment was performed by fabricating the quasi-two dimensional microfluidic chip model to imitate the internal skeleton and pore structure of porous media. The permeability of chip model was calculated by measuring and modifying the pressure drop of both end of the chip model. Computational fluid dynamics (CFD) method was adopted to make the numerical simulation of the seepage process compared with the results of experiment. Under the same condition, compared with the chip model with the square arrangement micro-pillar, the chip model with staggered micro-pillar showed that the tortuosity increased with an amplitude of 5.1%—7.9% microscopically, the flow resistance and pressure drop increased and the permeability decreased with an amplitude of 4.5%—7.4% macroscopically. The permeability of chip models was not only related to the internal pore structure and porosity, but also related to particle diameter and particle arrangement. When the porosity of model was 0.327—0.900, the permeability of the chip model obtained by the numerical simulation method was closed to the experimental results with the error of 9.78%—28.43%. Kozeny-Carman (KC) equation could not predict the experiment results correctly and the maximum error was 73.97%. A modified parallel plate duct flow equation was proposed to predict the permeability of quasi-two dimensional microfluidic chip model. The curve of predicted permeability was consistent well with the numerical and experimental data.nt well with the numerical and experimental data.
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Received: 10 May 2022
Published: 09 May 2023
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Fund: 国家自然科学基金资助项目(51988101) |
Corresponding Authors:
Te BA
E-mail: nsk@zju.edu.cn;ba-te@zju.edu.cn
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基于微流控芯片模型的渗流实验与数值模拟
基于微流控芯片加工技术,采用显微镜-微观模型实验装置,通过制作准二维微流控芯片模型来模拟多孔介质内部的骨架及孔隙结构,开展多孔介质渗流实验. 通过测量芯片模型两端的压降并进行修正,计算芯片模型的渗透率. 采用计算流体力学方法(CFD)对渗流过程进行数值模拟,并与实验结果进行对比分析. 结果表明:在相同条件下,相对于微柱方形排列的芯片模型,微柱错开排列的芯片模型在微观上表现为迂曲度增大,增大的幅值为5.1%~7.9%;在宏观上表现为流阻和压降更大,渗透率更低,降低的幅值为4.5%~7.4%. 芯片模型渗透率不仅与内部孔隙通道结构和孔隙率有关,还与颗粒直径和颗粒排列方式相关. 当模型孔隙率为0.327~0.900时,数值模拟方法所得的微流控芯片模型的渗透率与实验所测结果接近,误差为9.78%~28.43%. Kozeny-Carman (KC)公式不能准确预测实验结果,并且最大误差为73.97%. 提出修正平行板间导管流(平板流)渗流公式预测准二维微流控芯片模型渗透率,预测渗透率曲线与数值模拟和实验数据具有很好的一致性.
关键词:
多孔介质,
渗透率,
微流控芯片模型,
Kozeny-Carman方程,
平板流
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