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基于单颗磨粒划切试验的SiCp/Al复合材料表面去除机理研究 |
张红哲1( ),张旭1,朱晓春1,鲍永杰2,*( ) |
1. 大连理工大学 工程训练中心,辽宁 大连 116023 2. 大连海事大学 轮机工程学院,辽宁 大连 116026 |
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Surface removal mechanism study of SiCp/Al composites based on single-point cutting test |
Hong-zhe ZHANG1( ),Xu ZHANG1,Xiao-chun ZHU1,Yong-jie BAO2,*( ) |
1. Engineering Training Center, Dalian University of Technology, Dalian 116023, China 2. Marine Engineering College, Dalian Maritime University, Dalian 116026, China |
引用本文:
张红哲,张旭,朱晓春,鲍永杰. 基于单颗磨粒划切试验的SiCp/Al复合材料表面去除机理研究[J]. 浙江大学学报(工学版), 2022, 56(2): 388-397.
Hong-zhe ZHANG,Xu ZHANG,Xiao-chun ZHU,Yong-jie BAO. Surface removal mechanism study of SiCp/Al composites based on single-point cutting test. Journal of ZheJiang University (Engineering Science), 2022, 56(2): 388-397.
链接本文:
https://www.zjujournals.com/eng/CN/10.3785/j.issn.1008-973X.2022.02.020
或
https://www.zjujournals.com/eng/CN/Y2022/V56/I2/388
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