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浙江大学学报(工学版)
Journal of ZheJiang University (Engineering Science)  2021, Vol. 55 Issue (5): 984-990    DOI: 10.3785/j.issn.1008-973X.2021.05.019
    
Micromechanical properties of electronic glass using nanoindentation technology
Ya-xian ZHAO1(),Ye-cheng MA1,Zi-qiang CHENG1,Xin CAO2,Yong LIU1,*(),Gao-rong HAN1
1. School of Material Science and Engineering, State Key Laboratory of Silicon Material Science, Hangzhou 310027, China
2. Bengbu Design and Research Institute for Glass Industry Co. Ltd, Bengbu 233018, China
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Abstract  

Advanced nanoindentation technology was used to record load-displacement curves of typical electronic glasses, including soda lime silicate, alkali-free boroaluminosilicate and alkali aluminosilicate glasses, in order to study the microscopic mechanical properties of different electronic glasses. Hardness and elastic modulus were calculated using the Oliver-Pharr method and elastoplastic deformation theory. The hardness of glass is mainly related to the bonding degree of glass structure. The higher the average number of non-bridging oxygen, the easier it is to densify under stress, thus the lower the hardness. The elastic modulus mainly depends on the strength of chemical bond between particles. Stronger chemical bond leads to smaller deformation and larger elastic modulus. Different trends were observed for the elastic modulus and the hardness measured by the nine-point method. Microscopic uniformity of the glass samples has been evaluated based on the intrinsic relationship between hardness, elastic modulus and energy dissipation. Results showed that the alkali-free boroaluminosilicate glass had the best mechanical properties with high recovery resistance and local energy dissipation, making it not easy to cause overall damage. Samples prepared by overflow down-draw process showed less fluctuations in the local mechanical properties and got better micromechanical uniformity compared with samples prepared by float process.

Key words： nanoindentation technology      hardness      elastic modulus      energy dissipation      microscopic uniformity     
Received: 20 March 2020      Published: 10 June 2021
CLC:  TQ 171.71  
Fund:  “十三五”国家重点研发计划资助项目（2016YFB0303700）；国家自然科学基金资助项目（U1809217，51672242）；浮法玻璃新技术国家重点实验室开放课题基金资助项目
Corresponding Authors: Yong LIU     E-mail: 3130104409@zju.edu.cn;liuyong.mse@zju.edu.cn
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Ya-xian ZHAO
Ye-cheng MA
Zi-qiang CHENG
Xin CAO
Yong LIU
Gao-rong HAN
Cite this article:

Ya-xian ZHAO,Ye-cheng MA,Zi-qiang CHENG,Xin CAO,Yong LIU,Gao-rong HAN. Micromechanical properties of electronic glass using nanoindentation technology. Journal of ZheJiang University (Engineering Science), 2021, 55(5): 984-990.

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http://www.zjujournals.com/eng/10.3785/j.issn.1008-973X.2021.05.019     OR     http://www.zjujournals.com/eng/Y2021/V55/I5/984


基于纳米压痕技术的电子玻璃微观力学性能研究

为了研究不同电子玻璃的微观力学性能，采用先进的纳米压痕技术记录钠钙硅、无碱硼铝硅和碱铝硅等典型电子玻璃的载荷-位移曲线，利用Oliver-Pharr方法和经典的弹塑性变形理论，计算玻璃的硬度和弹性模量. 玻璃的硬度主要与结构的键合度相关，平均非桥氧数越高，外力作用下越容易致密化，硬度越小；弹性模量主要取决于质点间的化学键强度，化学键力越强，变形越小，弹性模量越大；九点法测得的弹性模量与硬度的变化趋势不完全相同，借助硬度-弹性模量-能量耗散之间的本征关系，评价玻璃样品的微观均匀性，其中无碱硼铝硅玻璃的恢复阻力大，局部能量耗散大，不容易引起整体破坏，力学性能最好；与浮法工艺相比，溢流下拉法制备样品的局部力学性能波动较小，微观均匀性较好.


关键词： 纳米压痕技术,  硬度,  弹性模量,  能量耗散,  微观均匀性 
电子玻璃种类 工艺 厚度/mm 编号
钠钙硅玻璃 浮法 1.10 S1
无碱硼铝硅玻璃 溢流下拉法 0.30 S2
无碱硼铝硅玻璃 浮法 0.33 S3
碱铝硅玻璃 溢流下拉法 0.40 S4
Tab.1 Type, production process and thickness of electronic glasses
Fig.1 Load-displacement curve of nanoindentation on glass surface
Fig.2 Dot matrix for nanoindentation test
Fig.3 Hardness of electronic glass samples and impression images of S4 observed under optical microscope
%
种类 编号 r
（SiO2） 		r
（Al2O3） 		r
（B2O3） 		r
（Na2O+K2O） 		r
（CaO+MgO）
钠钙硅 S1 71.67 0.94 ? 13.24 14.15
无碱硼铝硅 S2 68.21 10.78 9.87 ? 11.14
无碱硼铝硅 S3 68.78 11.62 8.01 ? 11.59
碱铝硅 S4 64.94 10.34 0.09 15.78 8.85
Tab.2 Chemical composition of experimental glass sample
Fig.4 Degree of bonding of experimental glass samples and average number of bridging and non-bridging oxygen
Fig.5 Elastic modulus of electronic glasses
Fig.6 Elastic modulus and hardness of different electronic glasses at different test points
Fig.7 Recovery resistance of glass samples prepared by two processes
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