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浙江大学学报(工学版)
浙江大学学报(工学版)  2020, Vol. 54 Issue (7): 1335-1340    DOI: 10.3785/j.issn.1008-973X.2020.07.011
机械与能源工程     
芯片键合纵弯复合超声换能器的设计与试验
胡广豪1(),薛进学1,马文举1,隆志力2,*()
1. 河南科技大学 机械工程学院，河南 洛阳 471003
2. 哈尔滨工业大学（深圳） 机电工程与自动化学院，广东 深圳 518055
Design and experiment of longitudinal-flexural composite ultrasonic transducer for chip bonding
Guang-hao HU1(),Jin-xue XUE1,Wen-ju MA1,Zhi-li LONG2,*()
1. School of Mechatronics Engineering, Henan University of Science and Technology, Luoyang 471003, China
2. School of Mechatronics Engineering and Automation, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
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摘要：

为了解决当前采用一维纵向超声加载模式进行芯片键合时造成结合面不充分的问题，设计纵弯复合超声能量加载模式的压电超声换能器，实现轴向纵振和水平弯振复合的超声振动代替传统单一的轴向振动. 采用ANSYS软件，对换能器有限元模型进行模态分析和谐响应分析，得到换能器纵振和弯振模态的谐振频率及振型. 通过调节换能器结构尺寸，实现纵振与弯振模态的简并. 采用阻抗分析仪对样机的频率和阻抗进行测试，使用激光多普勒测振仪测试换能器的纵振与弯振幅值，测试结果与有限元仿真计算结果一致，发现纵向与弯曲振幅均随着驱动电压的增加呈近似线性上升趋势, 证明设计的压电换能器实现了纵弯复合振动.
关键词： 超声换能器;  纵弯复合振动;  模态分析;  谐响应分析;  芯片键合    
Abstract:

A piezoelectric transducer with longitudinal-flexural composite ultrasonic mode was developed in order to solve the problem that the ultrasonic energy with one-dimensional longitudinal mode causes insufficient bonding area during chip bonding. The transducer can generate composite ultrasonic vibration to replace the conventional longitudinal vibration. The finite element simulation by ANSYS Workbench was employed to conduct the modal analysis and harmonic response analysis of transducer. The resonant frequency and mode shape of the longitudinal and flexural modes were obtained. The longitudinal and the flexural vibration modes were degenerated by adjusting the size of the transducer structure. The frequency and impedance testing of the prototype were conducted by impedance analyzer. The longitudinal and flexural amplitude of the transducer were measured by laser Doppler vibrometer. The experimental results accorded with the finite element calculation. The amplitude of the longitudinal and flexural vibration showed an upward tendency with the increasing of driving voltage. Results prove that the designed transducer can achieve the longitudinal-flexural composite vibration.
Key words: ultrasonic transducer    longitudinal-flexural composite vibration    modal analysis    harmonic response analysis    chip bonding
收稿日期: 2019-07-03 出版日期: 2020-07-05
CLC:  TB 552  
基金资助: 国家自然科学基金资助项目(U1713206)；深圳市学科布局基础研究资助项目(JCYJ20170413112645981，JCYJ20150928162432701)
通讯作者: 隆志力     E-mail: 632944546@qq.com;longzhili@hit.edu.cn
作者简介: 胡广豪（1995—），男，硕士生，从事芯片键合换能器设计的研究. orcid.org/0000-0002-7452-1170. E-mail： 632944546@qq.com
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引用本文:

胡广豪,薛进学,马文举,隆志力. 芯片键合纵弯复合超声换能器的设计与试验[J]. 浙江大学学报(工学版), 2020, 54(7): 1335-1340.

Guang-hao HU,Jin-xue XUE,Wen-ju MA,Zhi-li LONG. Design and experiment of longitudinal-flexural composite ultrasonic transducer for chip bonding. Journal of ZheJiang University (Engineering Science), 2020, 54(7): 1335-1340.

链接本文:

http://www.zjujournals.com/eng/CN/10.3785/j.issn.1008-973X.2020.07.011    或    http://www.zjujournals.com/eng/CN/Y2020/V54/I7/1335

图 1  纵弯换能器的结构示意图
图 2  纵向超声换能器的结构示意图
Ls L1 L2 L3 D1 D2
10 9 18 30 13.5 8
表 1  纵向超声换能器的结构参数
组成部分 材料 ρ/（kg·m?3） E/（1011N·m?2） μ
后盖板变幅杆安装环 316不锈钢 7 800 2.06 0.29
劈刀 钨钢 4 000 3.13 0.27
预紧螺钉 45钢 7 850 2.05 0.30
表 2  换能器各部件材料特性参数
图 3)  纵向振动模态
图 4  弯曲振动模态
图 5  纵振模态位移振型
图 6  弯振模态位移振型
图 7  纵向和弯曲振动模态位移振型
图 8  谐响应分析时振幅随频率的变化曲线
图 9  纵弯换能器实物图
图 10  纵弯换能器的频率特性曲线
图 11  纵弯换能器的振动测试平台
图 12  纵弯换能器振幅曲线
图 13  振幅与驱动电压的关系
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