机械与能源工程 |
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芯片键合纵弯复合超声换能器的设计与试验 |
胡广豪1( ),薛进学1,马文举1,隆志力2,*( ) |
1. 河南科技大学 机械工程学院,河南 洛阳 471003 2. 哈尔滨工业大学(深圳) 机电工程与自动化学院,广东 深圳 518055 |
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Design and experiment of longitudinal-flexural composite ultrasonic transducer for chip bonding |
Guang-hao HU1( ),Jin-xue XUE1,Wen-ju MA1,Zhi-li LONG2,*( ) |
1. School of Mechatronics Engineering, Henan University of Science and Technology, Luoyang 471003, China 2. School of Mechatronics Engineering and Automation, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China |
引用本文:
胡广豪,薛进学,马文举,隆志力. 芯片键合纵弯复合超声换能器的设计与试验[J]. 浙江大学学报(工学版), 2020, 54(7): 1335-1340.
Guang-hao HU,Jin-xue XUE,Wen-ju MA,Zhi-li LONG. Design and experiment of longitudinal-flexural composite ultrasonic transducer for chip bonding. Journal of ZheJiang University (Engineering Science), 2020, 54(7): 1335-1340.
链接本文:
http://www.zjujournals.com/eng/CN/10.3785/j.issn.1008-973X.2020.07.011
或
http://www.zjujournals.com/eng/CN/Y2020/V54/I7/1335
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