无线电电子学、电信技术 |
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CMOS兼容的微机械热电堆红外探测器阵列研究 |
徐德辉1,2, 熊斌1, 王跃林1 |
1.中国科学院上海微系统与信息技术研究所 传感技术国家重点实验室,微系统技术重点实验室, 上海 200050; 2.中国科学院 研究生院,北京 100039 |
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Study of CMOS compatible micromachined thermopile infra-red detector array |
XU De-hui1,2, XIONG Bin1, WANG Yue-lin1 |
1. State Key Laboratory of Transducer Technology, Science and Technology on Micro-system Laboratory, Chinese Academy of Sciences Shanghai Institute of Microsystem and Information Technology, Shanghai 200050, China; 2. Graduate School of Chinese Academy of Sciences, Beijing 100039, China |
[1] BALTES H, PAUL O, BRAND O. Micromachined thermally based CMOS microsensors[J].Proceedings of the IEEE, 1998, 86(8): 1660-1678. [2 ] GRAF A, ARNDT M, SAUER M, et al. Review of micromachined thermopiles for infrared detection [J].Measurement Science & Technology, 2007, 18(7): R59-R75. [3] 向桂山,王宣银,刘西亮.大距离吸收红外测温仪的关键技术研究[J].浙江大学学报:工学版,2006,40(12):2112-2116. XIANG Guishan, WANG Xuanyin, LIU Xiliang. Research on key technology of longdistancecoefficient infrared thermoscope [J]. Journal of Zhejiang University: Engineering Scinces, 2006, 40(12): 2112-2116. [4] 邹令敏,郝晓剑,周汉昌.基于MEMS热电堆传感器的高温测量技术[J].计量与测试技术,2009,36(8):25-27. ZHOU Lingmin, HAO Xiaojian, ZHOU Hanchang. The high temperature measurement technology based on MEMS thermopile sensor [J]. Metrology & Measurement Technique, 2009, 36(8): 25-27. [5] 蔡小五,马斌,梁平治.微机械非制冷红外热电堆探测器[J].红外技术,2005,27(1):34-38. CAI Xiaowu, MA Bin, LIANG Pingzhi. Micromachined uncooled infrared thermopile detector [J]. Infrared Technology, 2005, 27(1): 34-38. [6] Application Brief 1: A Simple DC Radiometer [EB/OL].[ 2006-11-12]. http:∥www.dexterresearch.com/system/files/protected_documents/8542_Rev_C.pdf. [7] LARRY Godfrey.Choosing the detector for your unique light sensing application. [EB/OL]. 20031102. www.optoelectronics.perkinelmer.com. [8] 徐峥谊.微机械热电堆红外探测器[D].上海:中国科学院上海微系统与信息技术研究所,2002. XU Zhenyi. Micromachined thermopile infrared detector [D]. Shanghai: Shanghai Institute of Microsystem and Information Technology, 2002. [9] 杨恒昭.CMOS兼容的干法刻蚀释放热电堆红外探测器[D].上海:中国科学院上海微系统与信息技术研究所,2008. YANG Hengzhao. CMOS compatible thermopile infrared detector released by dry etching [D]. Shanghai: Shanghai Institute of Microsystem and Information Technology, 2008. [10] SCHNEEBERGER N, PAUL O, BALTES H, Optimized structured absorbers for CMOS infrared detectors[C]∥Proceedings of the The 8th International Conference on SolidState Sensors and Actuators. Stockholm: IEEE, 1995: 648-651. [11] XU Dehui, XIONG Bin, WANG Yuelin, et al. Integrated thermoelectric infrared sensor with XeF2 etching [C]∥Proceedings of the 3rd SPIE International Symposium on Photoelectric Detection and Imaging. Beijing:SPIE,2009: 198-203. [12] 杨恒昭,熊斌,李铁,等.CMOS工艺兼容的热电堆红外探测器[J].半导体技术,2008,33(9):759-765. YANG Hengzhao, XIONG Bin, LI Tie, et al. CMOS process compatible thermopile infrared detector [J]. Semiconductor Technology, 2008, 33(9): 759-765. [13] XU Dehui, XIONG Bin, WANG Yuelin, et al. Hybrid Etching process and its application in thermopile infrared sensor [C]∥ Proceedings of the 2010 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Xiamen:IEEE, 2010: 417-420. |
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