| Aerospace Technology |
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| Low noise amplifier module with active bias using system in package technology |
| TONG Hua-qing, XU Shi-yi, HUANG Jian-hua, MO Jiong-jiong, WANG Zhi-yu,YU Fa-xin |
| School of Aeronautics and Astronautics, Zhejiang University, Hangzhou 310027, China |
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Abstract
An LNA module was proposed which overlaps major bands of GNSS for the requirement of rapidly developed multimode satellite integrated navigation technology. This LNA module was integrated in a 3 mm×3 mm×1 mm plastic package by using SIP technology, which included the die of LNA, and other off-chip circuits like the input/output matching circuits. No extra element was needed outside the package. The die was fabricated using low-noise 0.25 μm GaAs pHEMT technology. A novel active bias circuit was presented in the die, which can reduce the effects of fluctuation of both the supply voltage and ambient temperature. The LNA module can stably work in complex environments. The test results showed that in the operational frequency band of the LNA module, the noise figure was about 0.65 dB, the gain reached 20 dB, the input and output return loss was less than -10 dB. IIP3 was above 0.6 dBm at the central frequency. The LNA module worked with a 3.3 V supply voltage and 15 mW power dissipation．
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Published: 25 April 2017
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Cite this article:
TONG Hua-qing, XU Shi-yi, HUANG Jian-hua, MO Jiong-jiong, WANG Zhi-yu,YU Fa-xin. Low noise amplifier module with active bias using system in package technology. JOURNAL OF ZHEJIANG UNIVERSITY (ENGINEERING SCIENCE), 2017, 51(4): 834-840.
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带有源偏置的系统级封装低噪声放大器模块
针对近年来快速发展的多模卫星组合导航技术需求,提出覆盖主流全球卫星导航系统（GNSS）频段（包括GPS、GLONASS、伽利略、北斗）的低噪声放大器模块.该低噪声放大器模块采用SIP封装技术,在一个3 mm×3 mm×1 mm的塑料封装内集成了低噪声放大器芯片及输入输出匹配电路等片外电路,封装外无需额外分立元件.低噪声放大器芯片采用低噪声的0.25 μm GaAs pHEMT工艺流片.在芯片设计中,提出新型的有源偏置电路,可以抵御电源电压和环境温度的波动,使该低噪声放大器模块能够在复杂的环境中稳定工作.测试结果表明,该低噪声放大器模块在工作频段内噪声系数约为0.65 dB,增益可达20 dB,输入输出回波损耗小于-10 dB,中心频率输入三阶互调阻断点为0.6 dBm,电源电压为3.3 V,功耗为15 mW.
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