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ZJUS-A
Journal of Zhejiang University-SCIENCE A (Applied Physics & Engineering)  2006, Vol. 7 Issue (8 ): 8-    DOI: 10.1631/jzus.2006.A1343
    
Simulation study on fluctuant flow stress scale effect
SHEN Yu, YU Hu-ping, RUAN Xue-yu
National Die and Mold CAD Engineering Research Center, Shanghai Jiao Tong University, Shanghai 200030, China
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Abstract  Crystal plasticity theory was used to simulate upsetting tests of different dimensions and grain size micro copper cylinders in this study on the fluctuant flow stress scale effect. Results showed that with the decrease of billet grain quantity, flow stress fluctuation is not always increased, but there is a maximum. Through this study, the fluctuant flow stress scale effect can be understood deeper, and relevant necessary information was obtained for further prediction and control of this scale effect and to design the microforming process and die.

Key words： Microforming      Scale effect      Numerical simulation      Fluctuation     
Received: 16 December 2005     
CLC:  TG301  
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SHEN Yu
YU Hu-ping
RUAN Xue-yu
Cite this article:

SHEN Yu, YU Hu-ping, RUAN Xue-yu. Simulation study on fluctuant flow stress scale effect. Journal of Zhejiang University-SCIENCE A (Applied Physics & Engineering), 2006, 7(8 ): 8-.

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http://www.zjujournals.com/xueshu/zjus-a/10.1631/jzus.2006.A1343     OR     http://www.zjujournals.com/xueshu/zjus-a/Y2006/V7/I8 /8

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