| Modeling, Analysis, Optimization and Decision |
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| Optimization of the backflow gap of pneumatic jetting valve based on numerical simulation |
| WEI Xin-ming, SHEN Ping, SHAN Xiu-yang, LI Wei-song |
| College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China |
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Abstract Pneumatic jetting valve plays an indispensable role in the microelectronic packaging.However,the current pneumatic jetting valves can't meet the industrial requirement of droplet consistency completely for the frequent occurrence of jetting omission when it is used to jet high-viscosity adhesives.Jetting capacity must be enhanced to reduce the probability of the problem occurrence.As a key dimension of pneumatic jetting valve,the size of backflow gap influences its jetting capacity directly.In order to improve jetting capacity by optimizing backflow channes,a numerical model of the jetting process was established firstly and its validity was verified by corresponding experiment.Meanwhile,a Gaussian fitting model was built based on simulation data with different backflow channels.After that,the model was utilized to optimize the size of backflow gap by choosing droplet speed as optimization objective.The reliability of optimization results was verified by comparison of the jetting performance before and after optimization.Finally,the optimal size of backflow gap of pneumatic jetting valve was obtained.
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Received: 09 December 2015
Published: 28 June 2016
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基于数值仿真的气动喷射阀回流间隙的优化
气动喷射阀是微电子封装中不可或缺的封装设备,但现有气动喷射阀在喷射高黏胶液时仍不能完全满足工业界对胶滴一致性的需求,原因在于其喷射高黏胶液时常出现因喷射速度太小而导致的挂胶漏喷现象.要减小上述现象的发生概率,就必须提高现有气动喷射阀的高黏流体喷射能力.回流间隙作为气动喷射阀的关键尺寸,直接影响着喷射阀的喷射能力.为了通过优化回流间隙来提高喷射能力,首先建立气动喷射阀的胶液喷射数值仿真模型并通过实验验证其可靠性,同时基于不同回流间隙的仿真数据建立了相应的高斯拟合模型.然后利用拟合模型以胶滴滴落速度为优化目标对回流间隙进行优化,通过优化前后的喷射对比验证了优化结果的可靠性,最后获得气动喷射阀的最优回流间隙.
关键词：
气动喷射阀,
回流间隙,
点胶,
微电子封装,
优化设计
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[1] 高尚通.跨世纪的微电子封装[J].半导体情报,2000,37(6):1-7. GAO Shang-tong.Microelectronics packaging marching towards the new century[J].Semiconductor Information,2000,37(6):1-7.
[2] BABIARZ A J.Jetting small dots of high viscosity fluids for packaging applications[J].Semiconductor International,2006,29(9):2-8.
[3] NGUON B,JOUANEH M.Design and characterization of a precision fluid dispensing valve[J].The International Journal of Advanced Manufacturing Technology,2004,24(3/4):251-260.
[4] KOIDE A,SASAKI Y,YOSHIMURA Y,et al.Micromachined dispenser with high flow rate and high resolution[C]//Proceedings IEEE 13th Annual International Conference on Micro Electro Mechanical Systems.Miyavaki,Jan.23-27,2000.
[5] LEWIS A,BABIARZ A.Conductive adhesive dispensing process considerations[C]//Proceedings of the Technical Program:National Electronic Packaging and Production Conference.Anaheim,Feb.26-Mar.1,1999.
[6] MARONGELLI S R,DIXON D,PORCARIET S,et al.Practical production uses of SMT adhesives[C]//Proceeding of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium.Tokyo,1998:147-155.
[7] 孙道恒,高俊川,杜江,等.微电子封装点胶技术的研究进展[J].中国机械工程,2011,22(20):2513-2519. SUN Dao-heng,GAO Jun-chuan,DU Jiang,et al.Advances in fluid dispensing technology for micro-electronics packaging[J].China Mechanical Engineering,2011,22(20):2513-2519.
[8] 赵翼翔,陈新度,陈新.微电子封装中的流体点胶技术综述[J].液压与气动,2006(2):52-54. ZHAO Yi-xiang,CHEN Xin-du,CHEN Xin.An overview of fluid dispensing technology for micro-electronics packaging[J].Chinese Hydraulics & Pneumatics,2006(2):52-54.
[9] CHEN X B.Modeling and control of fluid dispensing process:a state-of-the-art review[J].The International Journal of Advanced Manufacturing Technology,2009,43(3/4):276-286.
[10] 李章平,邓圭玲.精密点胶螺杆泵胶液流动分析与数值仿真[J].中国机械工程,2007,18(17):2102-2107. LI Zhang-ping,DENG Gui-ling.Numerical simulations and analysis of three-dimensional flows in the archimedes pump on dispensing[J].China Mechanical Engineering,2007,18(17):2102-2107.
[11] PIRACCI A F.Advantages of non-contact dispensing in SMT assembly processes[C]//SMTA International Conference Proceedings.Asymtek,2000-09-24.
[12] PIRACCI A F.Practical production applications for jetting technology[C]//Proceedings of APEX Conference.Long Beach,CA,2000:1-6.
[13] QUINONES H,BABIARZ A,DECK C,et al.Fluid jetting for next generation packages[C]//Proceedings of Packaging Technolog.Berlin,2002:1-8.
[14] NGUYEN Q H,CHOI S B.Modeling of unsteady laminar flow based on steady solution in jetting dispensing process[J].IEEE Transactions on Electronics Packaging Manufacturing,2008,31(2):134-142.
[15] SHAN X Y,CHEN Y,PENG X,et al.Modeling of laminar fluid flow in jet dispensing process[C].15th International Conference on Electronic Packaging Technology (ICEPT).Chengdu,Aug.12-15,2014.
[16] QUOC H N,HAN Y M,CHOI S B,et al.Dynamic characteristics of a new jetting dispenser driven by piezostack actuator[J].IEEE Transactions on Electronics Packaging Manufacturing,2008,31(3):248-259.
[17] CHEN Y,WANG F L,LI H X,et al.Experimental and modeling study of high-viscosity silicone jet dispensing process for LED packaging[C].15th International Conference on Electronic Packaging Technology (ICEPT).Chengdu,Aug.12-15,2014.
[18] 彭先安.面向高性能LED封装的气动喷射阀喷胶性能研究[D].长沙:中南大学机电工程学院,2014:85-90. PENG Xian-an.Research on the performance of pneumatic jetting valve in the dispensing of high-performance LED package[D].Changsha:Central South University,College of Mechanical and Electrical Engineering,2014:85-90. |
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