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浙江大学学报(工学版)
Journal of ZheJiang University (Engineering Science)  2021, Vol. 55 Issue (8): 1594-1606    DOI: 10.3785/j.issn.1008-973X.2021.08.021
    
Photocurable 3D printing molding of propellants and explosives
Bo-jun TAN(),Bin CHEN,Ya-jing LIU,Wei WANG,Zi-sen LI,Ying-lei WANG(),Chuan XIAO
1. Xi’an Modern Chemistry Research Institute, Xi’an 710065, China
2. Advanced Technology Generalization Institute of China North Industries Group, Beijing 100089, China
3. Academy of Ordnance Science, Beijing 100089, China
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Abstract  

The research status of photocuring 3D printing technology in gun propellant, propellants and explosives were summarized according to the technical characteristics and application directions. The principle and process characteristics of stereo lithography apparatus, digital light process and continuous liquid interface production were generalized. The problems in the research of photocurable 3D printing molding of propellants and explosives were analyzed, the importance of new adhesives for photocurable 3D printing molding of propellants and explosives was put forward, and the development direction and trend of photocurable adhesive were summarized. It is pointed out that the photocuring 3D printing technology of propellants and explosives should be systematically studied according to the application background, and the design and preparation of energetic adhesive, the interaction between adhesive and solid packing surface, the process adaptability of formulations and the fine characterization of performance should be systematically studied to provide reference for the application of photocurable 3D printing technology in propellants and explosives.

Key words： photocurable 3D printing      development      propellants and explosives      molding principle      adhesive material     
Received: 01 April 2021      Published: 01 September 2021
CLC:  O 63  
  TQ 32  
Fund:  国家自然科学基金资助项目（21875185，22005238，22105156）
Corresponding Authors: Ying-lei WANG     E-mail: tanbj204@163.com;wangyl204@163.com
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Bo-jun TAN
Bin CHEN
Ya-jing LIU
Wei WANG
Zi-sen LI
Ying-lei WANG
Chuan XIAO
Cite this article:

Bo-jun TAN,Bin CHEN,Ya-jing LIU,Wei WANG,Zi-sen LI,Ying-lei WANG,Chuan XIAO. Photocurable 3D printing molding of propellants and explosives. Journal of ZheJiang University (Engineering Science), 2021, 55(8): 1594-1606.

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https://www.zjujournals.com/eng/10.3785/j.issn.1008-973X.2021.08.021     OR     https://www.zjujournals.com/eng/Y2021/V55/I8/1594


火炸药光固化3D打印成型

针对发射药、推进剂、炸药光固化3D打印技术，按照光固化3D打印技术的特点和应用方向，综述火炸药光固化3D打印技术的研究进展. 概述立体光固化成型技术、数字光处理技术、连续液面制造技术的成型原理以及工艺特点，分析光固化3D打印火炸药研究存在的问题，提出光固化3D打印火炸药采用新型黏合剂的重要性，总结光固化黏合剂的发展方向和趋势，并对火炸药光固化3D打印技术发展方向进行预测. 指出火炸药光固化3D打印技术应按照火炸药的应用背景，对光固化3D打印火炸药用含能黏合剂设计与制备、黏合剂与固体填料表界面作用、工艺适配性、性能精细化表征进行系统化研究，为光固化3D打印技术在火炸药中的应用提供参考.


关键词： 光固化3D打印,  研究进展,  火炸药,  成型原理,  黏合剂 
Fig.1 Composition of photocurable 3D printing adhesive system
Fig.2 Principle of photocuring molding
Fig.3 Forming principle of SLA technology
Fig.4 Forming principle of DLP technology
Fig.5 Forming principle of CLIP technology
技术名称 光固化方式 打印速度 主要优点 主要缺点
SLA 扫描式 慢 性价比高 打印速度慢
DLP 面投影式 较快 分辨率比SLA高 质量受限于
像素尺寸
CLIP 掩膜图像投影式 最快 速度最快 价格高昂；
对光敏树脂要求高
Tab.1 SLA、DLP and CLIP technology comparison
Fig.6 Gun propellant printed by TNO
Fig.7 MPD-gun propellant
Fig.8 Evaluation test of MPD
Fig.9 Preparation and molding test of HTPB propellant blanking system
Fig.10 Forming test renderings of HTPB composite propellant substitution system and burning figure of printed strips
Fig.11 Evaluation test of MPD performed with Gau-8 test gun
Fig.12 MEMS propellant chip compartment and charging principle
Fig.13 Function diagram of rapid prototyping system for manufacturing chemical chip
Fig.14 Main component of photocurable adhesive proposed by Xu di[46]
Fig.15 Architecture diagram of energetic chip rapid prototyping software
Fig.16 Main component of photocurable adhesive system proposed by Zhu jin-zhen[47]
Fig.17 Ink-jet molding system mechanism diagram
Fig.18 Main component of photocurable adhesive system proposed by Wang jian[48]
Fig.19 Main component of energetic ink formula proposed by Xing zong-ren[49]
Fig.20 Simulation, print renderings and ignition diagram
Fig.21 Main component of photocurable adhesive system proposed by Wang jing-long[50]
Fig.22 Refined RDX surface morphology
Fig.23 Main component of photocurable adhesive system proposed by Yao yi-long[51]
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