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浙江大学学报(工学版)
浙江大学学报(工学版)
电气工程     
计及裂纹损伤的IGBT模块热疲劳失效分析
江南, 陈民铀, 徐盛友, 赖伟, 高兵
重庆大学 输配电装备及系统安全与新技术国家重点实验室,重庆 400044
Thermal fatigue of IGBT module considering crack damage
JIANG Nan, CHEN Min-you, XU Sheng-you, LAI Wei, GAO Bing
State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing 400044, China
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摘要：

以实际IGBT功率模块为研究对象,通过有限元分析技术(FEM),探究裂纹损伤对IGBT模块热特性及疲劳寿命评估的影响规律,通过加速老化实验对有限元仿真结果进行验证.结果表明,焊料层裂纹是造成IGBT模块热阻增加的主要原因,在裂纹未萌生和萌生初期,裂纹对模块热特性的影响较小；一旦模块损伤到某一阶段,随着裂纹的继续扩展,模块热阻将近似指数增大,继续服役将导致功率模块在短时间内失效.通过研究发现,IGBT模块的疲劳寿命不仅与功率循环条件相关,还受到焊料层疲劳现状的影响,因此计及焊料层的疲劳累积效应的物理寿命模型相对于解析寿命模型能够更准确地对IGBT模块寿命进行评估.
Abstract:

The effect of crack damage on the thermal characteristics and fatigue life of an actual IGBT module was analyzed based on finite element method (FEM), and the simulation results were verified by aging test. Results show that crack in the solder layer is the main reason to increase the thermal resistance of IGBT module. When crack length is small, the relation between crack length and the thermal resistance is very weak. However, once the crack damage accumulates to a certain stage, the thermal resistance will have a near-exponential increase, then the IGBT module will fail in a short time. Fatigue life of the IGBT module is not only associated with power cycling conditions but also influenced by the fatigue status of solder layer. The physical life model which considers fatigue accumulation effect can evaluate the life of the IGBT module more accurately than the analytic life model.
出版日期: 2017-04-25
CLC:  TM 23  
基金资助:

国家自然科学基金资助项目(51477019)；中央高校基本科研业务费资助项目（106112015CDJXY150004）.
通讯作者: 陈民铀，男，教授．     E-mail: minyouchen@cqu.edu.cn
作者简介: 江南（1990—），女，硕士生，从事电力电子器件可靠性的研究．ORCID：0000-0003-3961-4764. E-mail：jnhappy0204@hotmail.com
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江南, 陈民铀, 徐盛友, 赖伟, 高兵. 计及裂纹损伤的IGBT模块热疲劳失效分析[J]. 浙江大学学报(工学版), 10.3785/j.issn.1008-973X.2017.04.025.

JIANG Nan, CHEN Min-you, XU Sheng-you, LAI Wei, GAO Bing. Thermal fatigue of IGBT module considering crack damage. JOURNAL OF ZHEJIANG UNIVERSITY (ENGINEERING SCIENCE), 10.3785/j.issn.1008-973X.2017.04.025.

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