建模、仿真、分析与决策 |
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基于流固耦合的弹载电子设备瞬态热仿真分析方法 |
王萌1, 徐晓婷2, 李文强3 |
1. 中国电子科技集团 第29研究所, 四川 成都 610000;
2. 成都飞机工业(集团)有限责任公司, 四川 成都 610065;
3. 四川大学 制造科学与工程学院, 四川 成都 610065 |
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Transient thermal simulation analysis method of missile-borne electronic equipment based on fluid-solid coupling |
WANG Meng1, XU Xiao-ting2, LI Wen-qiang3 |
1. The 29 th Institute, China Electronic Technology Group Corporation, Chengdu 610000, China;
2. Chengdu Aircraft Industrial(Group) Co., Ltd., Chengdu 610065, China;
3. School of Manufacturing Science and Engineering, Sichuan University, Chengdu 610065, China |
引用本文:
王萌, 徐晓婷, 李文强. 基于流固耦合的弹载电子设备瞬态热仿真分析方法[J]. 工程设计学报, 2018, 25(2): 194-199,208.
WANG Meng, XU Xiao-ting, LI Wen-qiang. Transient thermal simulation analysis method of missile-borne electronic equipment based on fluid-solid coupling. Chinese Journal of Engineering Design, 2018, 25(2): 194-199,208.
链接本文:
https://www.zjujournals.com/gcsjxb/CN/10.3785/j.issn.1006-754X.2018.02.010
或
https://www.zjujournals.com/gcsjxb/CN/Y2018/V25/I2/194
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