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浙江大学学报(工学版)
J4  2011, Vol. 45 Issue (6): 1048-1051    DOI: 10.3785/j.issn.1008-973X.2011.06.014
    
Growth and characterization of local biaxial strained SiGe
LI Jing-chun, YANG Hong-dong, YANG Yang, QUAN Feng-xi
School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of
China, Chengdu 610054, China
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Abstract  

The fabrication and Characterization of local biaxial strained SiGe on Si substrate with ploy-Si sidewall, using solid source MBE, were presented. The scan electron microscopy (SEM), atomic force microscopy (AFM), high resolution X-ray diffraction (HRXRD) and transmission electron microscopy (TEM) are used to characterize the surface morphology and the material quality of strained SiGe. The measurement results show that the Ge concentrations and thickness of strained SiGe layer can be accurate to control, the surface root mean square roughness is 0.45 nm and vertical strain was about 1.175% for the local strained SiGe layer. In this work, the quality of the epitaxial film was improved by a poly-Si sidewall. Threading dislocations density was 1.2×103 cm-2. No dislocation accumulation existed on the boundary of the windows, which indicates the high quality of the SiGe film. The experiment results show that the technology present in this paper meets the fabrication requirements of SiGe BiCMOS.

Published: 14 July 2011
CLC:  TN 304  
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Cite this article:

LI Jing-chun, YANG Hong-dong, YANG Yang, QUAN Feng-xi. Growth and characterization of local biaxial strained SiGe. J4, 2011, 45(6): 1048-1051.

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https://www.zjujournals.com/eng/10.3785/j.issn.1008-973X.2011.06.014     OR     https://www.zjujournals.com/eng/Y2011/V45/I6/1048


局部双轴应变SiGe材料的生长与表征

利用分子束外延（MBE）对双轴应变SiGe局部区域外延生长和表征进行了研究.图形窗口边界采用多晶Si侧墙，多层SiGe薄膜分段温度生长.采用扫描电子显微镜（SEM）、原子力显微镜（AFM）、X射线双晶衍射（XRD）、透射电镜（TEM）和位错密度测试等多种实验技术，结果表明：薄膜表面窗口内双轴应变SiGe薄膜厚度和Ge组分得到精确控制，垂直应变度达到1.175%，其表面粗糙度为0.45 nm，SiGe位错密度为1.2×103 cm-2.由于采用多晶Si侧墙，外延材料表面没有发现窗口边缘处明显位错堆积.实验证实，采用该技术生长的局部双轴应变SiGe薄膜质量良好，基本满足SiGe BiCMOS器件制备要求.

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