Please wait a minute...
浙江大学学报(工学版)
浙江大学学报(工学版)  2017, Vol. 51 Issue (9): 1815-1823    DOI: 10.3785/j.issn.1008-973X.2017.09.016
机械工程     
UV-LIGA工艺误差对MEMS万向惯性开关性能的影响
曹云, 席占稳, 王炅, 聂伟荣, 孔南
南京理工大学 机械工程学院, 江苏 南京 210094
Influence of UV-LIGA fabrication error on MEMS omnidirectional inertial switch's performance
CAO Yun, XI Zhan-wen, WANG Jiong, NIE Wei-rong, KONG Nan
School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China
 全文: PDF(3862 KB)   HTML
摘要：

为提高微机电系统（MEMS）万向惯性开关的性能，实现工程化应用，对其进行工艺误差与性能关系研究.基于多层UV-LIGA工艺制作多个开关样机，进行主要结构尺寸测量，并确定工艺误差方向；从UV-LIGA工艺过程的曝光、显影与电铸、腐蚀3个阶段，分析误差的产生机理，并进一步分析单一结构误差、非对称误差和偏心误差对开关阈值和接触时间的影响.结果表明：弹簧线宽、厚度、侧壁倾角和两电极间隙等单一结构尺寸的增大会导致阈值增大；非对称误差会导致开关各向刚度不一致，使阈值散布更大；偏心误差会大幅度减小开关轴向阈值，而对径向阈值影响较小.对多个开关样机的测试结果验证了开关工艺误差及单一结构误差对阈值影响的正确性.
Abstract:

Dependence of fabrication error on performance of a micro-electro-mechanical system (MEMS) omnidirectional inertial switch was investigated to enhance performance of the switch and implement its engineering application. The switch was fabricated by employing multi-layer UV-LIGA (Ultraviolet Lithography,Galvanoformung,Abformung) manufacturing technology. The main dimensions of the switch prototypes were measured and the direction of fabrication error was confirmed. Furthermore, the mechanism of fabrication error was discussed based on three phases including exposure, development and electroforming, and corrosion in the UV-LIGA process, and the influence of single structure error, asymmetrical error and eccentricity error on threshold and contact time of the switch was further analyzed. Results indicate that the threshold increases with the increase of single structure dimensions, such as spring width, thickness, sidewall angle and gap between two electrodes; asymmetric error leads to inconsistent stiffness in different directions and a larger threshold distribution; eccentricity error seriously decreases axial threshold, but hardly affects radial threshold. The tested results of the switch prototypes verifies the validity of fabrication error of the switch and influence of single structure error onthe threshold.
收稿日期: 2016-06-21 出版日期: 2017-08-25
CLC:  TH161.5  
基金资助:

国家自然科学基金资助项目（51475245）.
通讯作者: 席占稳,男,研究员.orcid.org/0000-0002-0936-8990.     E-mail: 4317045xi@sina.com
作者简介: 曹云(1990-),男,博士生,从事微机电系统研究.orcid.org/0000-0002-5376-2362.E-mail:caoyun0620@sina.com
服务　　
把本文推荐给朋友
加入引用管理器
E-mail Alert
作者相关文章　　

引用本文:

曹云, 席占稳, 王炅, 聂伟荣, 孔南. UV-LIGA工艺误差对MEMS万向惯性开关性能的影响[J]. 浙江大学学报(工学版), 2017, 51(9): 1815-1823.

CAO Yun, XI Zhan-wen, WANG Jiong, NIE Wei-rong, KONG Nan. Influence of UV-LIGA fabrication error on MEMS omnidirectional inertial switch's performance. JOURNAL OF ZHEJIANG UNIVERSITY (ENGINEERING SCIENCE), 2017, 51(9): 1815-1823.

链接本文:

http://www.zjujournals.com/eng/CN/10.3785/j.issn.1008-973X.2017.09.016    或    http://www.zjujournals.com/eng/CN/Y2017/V51/I9/1815

[1] MICHAELIS S,TIMME H J,WYCISK M,et al. Additive electroplating technology as a post-CMOS process for the production of MEMS acceleration-threshold switches for transportation applications[J]. Journal of Micromechanics and Microengineering,2000,10(2):120-123.
[2] MATSUNAGA T,ESASHI M. Acceleration switch with extended holding time using squeeze film effect for side airbag systems[J]. Sensors and Actuators A:Physical,2002,100(1):10-17.
[3] LEE J,SONG Y,JUNG H,et al. Deformable carbon nanotubecontact pads for inertial microswitch to extend contact duration[J]. IEEE Transactions on IndustrialElectronics,2012,59(12):4914-4920.
[4] XI Z,ZHANG P,NIE W,et al. A novel MEMS omnidirectional inertial switch with flexible electrodes[J]. Sensors and Actuators A:Physical, 2014, 212:93-101.
[5] SHAVEZIPUR M,PONNAMBALAM K,KHAJEPOUR A,et al. Fabrication uncertainties and yield optimization in MEMS tunable capacitors[J]. Sensors and Actuators A:Physical,2008,147(2):613-622.
[6] JOHNSON G C, ALLEN A M. MEMS process error characterization using lateral resonant structures[C]//Proceedings of SPIE 2004. San Jose:SPIE, 2004:264-272.
[7] LIU R,PADEN B,TURNER K. MEMS resonators that are robust to process-induced feature width variations[J]. Journal of Microelectromechanical Systems, 2002,11(5):505-511.
[8] 刘妤,温志渝.工艺特性对二维微加速度传感器性能的影响[J].功能材料与器件学报,2008,14(2):331-335. LIU Yu,WEN Zhi-yu. Effect of fabrication characteristic of 2D microaccelerometer on performance[J]. Journal of Functional Materials and Devices,2008,14(2):331-335.
[9] 施芹,裘安萍,苏岩,等.硅微陀螺仪的机械耦合误差分析[J].光学精密工程,2008,16(5):894-898. SHI Qin,QIU An-ping,SU Yan,et al. Mechanical coupling error of silicon microgyroscope[J]. Optics and Precision Engineering,2008,16(5):894-898.
[10] 戴强,于奇,束平,等.基于梳齿间距MEMS工艺误差的微传感器电容与静电力分布模型[J].仪表技术与传感器,2010(3):12-14. DAI Qiang,YU Qi,SHU Ping,et al. Capacitance and electrostatic force distribution models of micro sensors based on comb finger gaps MEMS process error[J]. Instrument Technique and Sensor,2010(3):12-14.
[11] 赵明.MEMS万向惯性开关制作工艺研究[D].大连:大连理工大学,2015.ZHAO Ming.Research on processing technique of MEMS omnidirectional inertial switch[D].Dalian:Dalian University of Technology,2015.
[12] DU L,ZHAO M,WANG A,et al.Fabrication of novel MEMS inertial switch with six layers on a metal substrate[J].[WTHZ]Microsystem Technologies[WTBZ],2015,21(9):2025-2032.
[13] LAWES R A.Manufacturing tolerances for UV LIGA using SU-8 resist[J].[WTHZ]Journal of Micromechanics and Microengineering[WTBZ],2005,15(11):2198-2203.
[14] 杜立群,秦江,刘冲,等.SU-8胶紫外光刻的尺寸精度研究[J].光学精密工程,2007,15(4):447-452.DU Li-qun,QIN Jiang,LIU Chong,et al.Study on dimensional precision of UV-lithography on SU-8 photoresist[J].[WTHZ]Optics and Precision Engineering[WTBZ],2007,15(4):447-452.
[15] 杜立群,刘亚萍,李永辉,等.超声处理对UV-LIGA工艺中SU-8胶溶胀的影响[J].光学精密工程,2012,20(9):2006-2013.DU Li-qun,LIU Ya-ping,LI Yong-hui,et al.Effect of ultrasonic treatment on SU-8 swelling in UV-LIGA technology[J].[WTHZ]Optics and Precision Engineering[WTBZ],2012,20(9):2006-2013.
[16] 卢伟.SU-8胶接触式UV光刻模拟[D].南京:东南大学,2006.LU Wei.Simulation of contact UV lithography process for SU-8 photoresists[D].Nanjing:Southeast University,2006.
[17] CHUANG Y J,TSENG F G,LIN W K.Reduction of diffraction effect of UV exposure on SU-8 negative thick photoresist by air gap elimination[J].[WTHZ]Microsystem Technologies[WTBZ],2002,8(4-5):308-313.
[18] RUZZU A,MATTHIS B.Swelling of PMMA-structures in aqueous solutions and room temperature Ni-electroforming[J].[WTHZ]Microsystem technologies[WTBZ],2002,8(2-3):116-119.
[19] GRIFFITHS S K,CROWELL J A W,KISTLER B L,et al.Dimensional errors in LIGA-produced metal structures due to thermal expansion and swelling of PMMA[J].[WTHZ]Journal of Micromechanics and Microengineering[WTBZ],2004,14(11):1548-1557.
[20] HEMKER K J,LAST H.Microsample tensile testing of LIGA nickel for MEMS applications[J].[WTHZ]Materials Science and Engineering:A[WTBZ],2001,319:882-886.
[21] VAN KAMPEN R P,WOLFFENBUTTEL R F.Modeling the mechanical behavior of bulk-micromachined silicon accelerometers[J].[WTHZ]Sensors and Actuators A:Physical[WTBZ],1998,64(2):137-150.
[22] LI G,LI Z,WANG C,et al.Design and fabrication of a highly symmetrical capacitive triaxial accelerometer[J].[WTHZ]Journal of Micromechanics and Microengineering[WTBZ],2001,11(1):48-54.
No related articles found!