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浙江大学学报(工学版)
J4  2012, Vol. 46 Issue (6): 1143-1147    DOI: 10.3785/j.issn.1008-973X.2012.06.027
海洋工程、工程力学     
非共面薄膜-基底结构多层封装及延展性分析
李正伟, 陶伟明
浙江大学 工程力学系,浙江 杭州 310027
Multi-layer encapsulation and stretchability analysis for
noncoplanar film-substrate structure
LI Zheng-wei, TAO Wei-ming
Department of Engineering Mechanics, Zhejiang University, Hangzhou 310027, China
 全文: PDF  HTML
摘要：

为减小柔性电子中非共面薄膜基底结构因封装而导致的延展性下降,提出一种多层封装结构形式,并对其延展性进行了研究. 通过对薄膜上下表面附近采用不同力学特性的聚二甲基硅氧烷(PDMS),形成层状封装结构. 在将薄膜及其上下封装层简化为复合梁的拉弯组合变形问题的基础上,采用有限元法计算了上下封装层的厚度、弹性模量等相关参数对结构整体延展性的影响.计算结果表明：上封装层弹性模量减小、厚度增加有利于改善延展性；下封装层的弹性模量适度高于基本封装材料且厚度合适的情况下可较大幅度提高结构延展性,而若弹性模量过高或厚度过大则可导致延展性的大幅下降.该多层封装结构设计和分析结果对于优化柔性电子器件结构具有参考和指导意义.
Abstract:

In order to reduce the stretchability degradation of the non-coplanar film/substrate structure in flexible electronics caused by encapsulation, a multi-layer encapsulation design was proposed and the stretchability was investigated. This design was achieved by adopting polydimethylsiloxane (PDMS) with different mechanical properties near the upper and lower bridge surfaces. By simplifying the structure of bridge, upper and lower encapsulation layers to tensile-bending composite beam, the influences of thickness, elastic modulus and other related parameters of the layers on the overall stretchability were analyzed by finite element method (FEM). The results show that the upper encapsulation layer with high thickness or/and low elastic modulus is benefit to improve the stretchability. Meanwhile, the stretchability can be considerably improved when the lower layer's modulus is moderately higher than that of the basic encapsulation material and the thickness is suitable. Nevertheless, the stretchability may decrease significantly when the lower layer's modulus is too high or the thickness is too large.
出版日期: 2012-07-24
:  O 346  
基金资助:

国家自然科学基金资助项目(10832009, 10972194)；浙江省自然科学基金资助项目(Y7080297).
通讯作者: 陶伟明，男，教授,博士.     E-mail: taowm@zju.edu.cn
作者简介: 李正伟（1986—），男， 硕士生，主要从事柔性电子器件力学和复杂结构力学分析. E-mail: zhengwei_1205@163.com
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引用本文:

李正伟, 陶伟明. 非共面薄膜-基底结构多层封装及延展性分析[J]. J4, 2012, 46(6): 1143-1147.

LI Zheng-wei, TAO Wei-ming. Multi-layer encapsulation and stretchability analysis for
noncoplanar film-substrate structure. J4, 2012, 46(6): 1143-1147.

链接本文:

http://www.zjujournals.com/eng/CN/10.3785/j.issn.1008-973X.2012.06.027    或    http://www.zjujournals.com/eng/CN/Y2012/V46/I6/1143

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