Please wait a minute...
浙江大学学报(工学版)
J4  2009, Vol. 43 Issue (09): 1728-1731    DOI: 10.3785/j.issn.1008-973X.2009.
    
Phase-changing sacrificial layer for UV-bonding of glass microfluidic chip at room temperature
ZHOU Shuai1, LV Chun-hua2, YIN Xue-feng1, ZHANG Lei1
(1.Institute of Microanalytical Systems, Zhejiang University, Hangzhou 310027,China；
2.Zhejiang Entry-Exit Inspection and Quarantine Bureau,Hangzhou 310012, China)
Download:   PDF(1233KB) HTML
Export: BibTeX | EndNote (RIS)      

Abstract  

A novel method for adhesive bonding of glass microfluidic chips at room temperature was developed. Channels in an etched glass substrate were filled with a heated paraffin liquid that formed a solid sacrificial layer at room temperature. Then the etched substrate and cover substrate were bonded together utilizing an UV-curable glue layer. An option shadow-mask was used to avoid any chance of glue curing inside the channel. The sacrificial layer was melted and removed leaving enclosed microfluidic channels once the sealing step was complete. Results showed that the chips were  successfully used for the separation of amino acids and metal electrodes can integrate into a microfluidic glass device．

CLC:  TN 405  
Service
E-mail this article
Add to my bookshelf
Add to citation manager
E-mail Alert
RSS
Articles by authors
Cite this article:

ZHOU Shuai, LV Chun-Hua, YAN Hua-Feng, DENG. Phase-changing sacrificial layer for UV-bonding of glass microfluidic chip at room temperature. J4, 2009, 43(09): 1728-1731.

URL:

http://www.zjujournals.com/eng/10.3785/j.issn.1008-973X.2009.     OR     http://www.zjujournals.com/eng/Y2009/V43/I09/1728


相变牺牲层结合UV胶室温黏接玻璃微流控芯片

提出了一种室温封合玻璃微流控芯片的新方法.利用毛细作用将熔化的石蜡液体填充开放的玻璃微通道,冷却后石蜡固体形成牺牲层材料.用UV胶作为黏接剂来封合玻璃基片和盖片.用紫外光通过掩模对UV胶进行选择性曝光, 使玻璃基片和盖片被UV胶黏接在一起.加热除去石蜡牺牲层后,得到微通道表面性质基本一致的玻璃微流控芯片.此芯片已成功用于氨基酸的电泳分离.此方法还可实现电极在玻璃芯片上的集成.


[1] HARRISON D J, MANZ A, FAN Z. et al. Capillary electrophoresis and sample injection systems integrated on a planar glass chip
[J]. Analytical Chemistry, 1992, 64(17): 1926-1932.


[2] CULBERTSON C T, JACOBSON S C, RAMSEY J M. Microchip devices for high-efficiency separations
[J].Analytical Chemistry, 2000, 72(23): 5814-5819.


[3] YIN Xue-feng,SHEN Hong,FANG Zhao-lun. A simplified microfabrication technology for production of glass microfluidic chips
[J]. Chinese Journal of Analytical Chemistry, 2003, 31(1): 116-119.


[4] CHIEM N, LOCKYEAR-SHULTZ L, ANDERSSON P, et al. Room temperature bonding of micromachined glass devices for capillary electrophoresis
[J]. Sensor and Actuators B, 2000, 63(3): 147-152.


[5] JIA Z J, FANG Q,FANG Z L. Bonding of glass microfluidic chips at room temperatures
[J].Analytical Chemistry, 2004, 76(18): 5597-5602.


[6] WANG H Y, FOOTE R S, JACOBSON S C, et al. Low temperature bonding for microfabrication of chemical analysis devices
[J]. Sensor and Actuators B, 1997, 45(3): 199-207.


[7] NAKANISHI H, NISHIMOTO T, KANAI M,et al. Condition optimisation, reliability evaluation of SiO2 –SiO2 HF bonding and its application for UV detection micro flow cell
[C]∥Proceeding of Transducers. Sendai, Japan:
[s.n.],1999:13-32.


[8] SAYAH A, SOLIGNAC D, CUENI T, et al. Development of novel low temperature bonding technologies for microchip chemical analysis applications
[J]. Sensor and Actuators A, 2000, 84(1-2): 103-108.


[9] SCHLAUTMANN S, BESSELINK G A J, PRABHU G R, et al. Fabrication of a microfluidic chip by UV bonding at room temperature for integration of temperature-sensitive layers
[J].Journal of Micromechanics and Microengineering, 2003, 13: S81-S84.


[10] HUANG Z, SANDERS J C, DUNSMOR C, et al. A method for UV-bonding in the fabrication of glass electrophoretic microchips
[J]. Electrophoresis, 2001, 22(18): 3924-3929.


[11] WU H, HUANG B, ZARE R N. Construction of microfluidic chips using polydimethylsiloxane for adhesive bonding
[J].Lab Chip, 2005, 5(12): 1393-1398.


[12] KELLY R T, PAN T, WOOLLEY A T. Phase-changing sacrificial materials for solvent bonding of high-performance polymeric capillary electrophoresis microchips.
[J]. Analytical Chemistry, 2005, 77(11): 3536- 3541.


[13] ZHANG L, YIN X F, FANG Z L. Negative pressure pinched sample injection for microchip-based electrophoresis
[J]. Lab Chip, 2006, 6(2): 258-264.
No related articles found!