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| Multi-objective optimization design for silicon substrate microchannel heat sink based on thermal resistance network model |
| YANG Chen-guang, SHAO Bao-dong, WANG Li-feng, YANG Yang |
| College of Architectural and Civil Engineering, Kunming University of Science and Technology, Kunming 650500, China |
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Abstract Microchannel heat sink has the advantages of high heat transfer efficiency and reliability, and it is useful for cooling micro-scale high heat flux density electronic components. In order to meet the performance requirements and control cost, it is necessary to optimize the heat transfer capability and flow resistance of the microchannel heat sink at the same time. The thermal resistance network model used in the traditional research is relatively simple, which can not well reflect the response of thermal resistance and flow resistance to the topological changes of the microchannel cross-section shape, and the optimization object is usually the size of a given shape section. A single-layer silicon substrate microchannel heat sink thermal resistance network model was proposed by discretization method. The heat sink fins were separated into smaller ones. According to the response of microthermal resistance to the width of microdots, and the contribution of microthermal resistance to the overall thermal resistance, the overall thermal resistance of microchannel was described. Taking the output power of micro-pump as the optimized boundary condition and the pressure drop and thermal resistance as the optimization targets, the size of quadrilateral uniform cross-section silicon substrate heat sink was optimized by SQP (sequential quadratic programming) method. The optimization results were simulated and verified by CFD (computational fluid dynamics). The results showed that the shape of the cross section was rectangular when the height of fin was low, and it gradually turned into a triangle as the height of the fin increased. In the design range, when the microchannel section was trapezoidal, the fin section was triangular, the heat transfer efficiency and pressure drop were ralatively dominant. Under boundary point method and ideal point method, the optimization results of microchannel height, fin width, groove bottom width and groove top width were 500, 50, 64.5, 114.5 μm and 500, 50, 50, 100 μm, respectively. This method can adjust the evaluation function according to the design requirements, meanwhile, the calculation result has important engineering significance and provides reference for designers.
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Received: 20 November 2017
Published: 28 August 2018
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基于热阻网络模型的硅基微槽热沉多目标优化设计
微槽热沉具有传热效率高、可靠性强的优点，可用于对微尺度高热流密度电子元件进行冷却。为满足其性能需求和控制成本，在对微槽热沉进行设计时需要对其传热能力和流动阻力同时进行优化。传统研究采用的热阻网络模型较为简单，不能很好地反映热阻和流动阻力对微槽道截面形状拓扑变化的响应，且其优化对象通常为既定截面的形状尺寸。为此提出一种基于离散化方法的单层硅基微槽热沉热阻网络模型，将热沉鳍片细分为厚度较小的微元，根据微元热阻对微元宽度的响应及微元热阻对整体热阻的贡献来描述微槽道的整体热阻。以微泵输出功率为优化边界条件，压降和热阻为优化目标，通过SQP（sequential quadratic programming，序列二次规划）方法对层流状态下四边形等截面硅基微槽热沉进行尺寸优化，利用CFD（computational fluid dynamics，计算流体动力学）对优化结果进行模拟和验证。结果表明，当鳍片高度较低时，鳍片截面形状为矩形，随着鳍高增加，截面形状有向三角形发展的趋势。在设计区间内，微槽道截面为梯形、鳍片截面为三角形时传热效率与压降相对占优。用边界点法和理想点法优化模型求得微槽道高度、鳍底宽、槽底宽、槽顶宽的优化结果分别为500，50，64.5，114.5 μm和500，50，50，100 μm。该方法能根据设计需求调整评价函数，同时计算结果具有重要工程意义，为微槽热沉设计人员提供参考。
关键词：
流固耦合,
多目标优化,
热阻网络模型,
微尺度冷却热沉,
多起点搜索
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