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工程设计学报
工程设计学报  2019, Vol. 26 Issue (3): 299-304    DOI: 10.3785/j.issn.1006-754X.2019.03.008
优化设计     
双向光收发组件探测器端耦合和封装工艺分析
颜科, 张帆, 仲顺顺, 舒斌, 戚媛婧
中南大学 机电工程学院， 湖南 长沙 410083
Analysis of coupling and packaging process for photodiode of bi-directional optical sub-assembly
YAN Ke, ZHANG Fan, ZHONG Shun-shun, SHU Bin, QI Yuan-jing
College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China
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摘要：

探测器响应度直接影响双向光收发组件（bi-directional optical sub-assembly，BOSA）的性能，探测器端的耦合和封装在BOSA生产中占据重要地位。为了系统分析BOSA生产中各偏移因素对探测器端耦合的影响，选择探测器电流响应度作为耦合标准进行实验，并通过分析实验结果来得出BOSA探测器端耦合和封装过程中的改进措施。参考BOSA的实际光路，建立光纤-波片-芯片耦合模型，模拟了光束偏移与耦合效率的关系；研究了BOSA耦合和封装工艺中产生的偏移，并分析它们对探测器端耦合效率的影响。随后使用自动耦合设备，对BOSA探测器端进行耦合实验，并分析波片角度偏移、波片与探测器透镜的高度差、探测器透镜水平偏移对耦合效率的影响。实验结果表明：探测器透镜水平偏移对耦合效率的影响最大，波片角度偏移、波片与探测器透镜的高度差对耦合效率的影响较小。研究结果为BOSA探测器端的耦合和封装提供了系统的理论指导，对BOSA的实际生产有一定参考价值。
关键词： 双向光收发组件;  探测器;  响应度;  偏移;  耦合效率    
Abstract:

Responsivity of photodiode directly affects the performance of the bi-directional optical sub-assembly (BOSA), and the coupling and packaging of the photodiode play an important role in production. In order to systematically analyze the influence of various offset factors of BOSA on the coupling of the photodiode, the photodiode current responsivity was selected as the coupling standard for experiment, and the improvement measures in the coupling and packaging process of the BOSA photodiode were obtained through the analysis of the experimental results. Referring to the actual optical path of BOSA, a fiber-filter-chip coupling model was established to simulate the relationship between beam offset and coupling efficiency. The offset generated in the BOSA coupling and packaging was studied and its effect on the coupling efficiency of the photodiode was analyzed. The coupling experiment was then performed on the BOSA photodiode using an automatic coupling device. The effects of the angular offset of filter, the height difference of filter-photodiode lens and the horizontal offset of photodiode lens on the coupling efficiency were analyzed. The experimental results showed that the horizontal offset of photodiode lens had the greatest influence on the coupling efficiency, and the angular offset of filter and the height difference of the filter-photodiode lens had little effect on the coupling efficiency. The research results provide systematic theoretical guidance for the coupling and packaging of BOSA photodiode, which has reference value for actual production.
Key words: bi-directional optical sub-assembly    photodiode    responsivity    offset    coupling efficiency
收稿日期: 2018-11-12 出版日期: 2019-06-28
CLC:  TH 162  
基金资助:

国家科技重大专项资金资助项目（2017YFB1104800）
通讯作者: 张帆 (1989—)，男，湖南长沙人，博士生，从事光学设计与制造研究，E-mail:826556689@qq.com     E-mail: 826556689@qq.com
作者简介: 颜科（1994—），男，湖南湘潭人，硕士生，从事光电子器件制造及其封装研究，E-mail：yanke2019@163.com，https://orcid.org/0000-0002-1932-0413
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引用本文:

颜科, 张帆, 仲顺顺, 舒斌, 戚媛婧. 双向光收发组件探测器端耦合和封装工艺分析[J]. 工程设计学报, 2019, 26(3): 299-304.

YAN Ke, ZHANG Fan, ZHONG Shun-shun, SHU Bin, QI Yuan-jing. Analysis of coupling and packaging process for photodiode of bi-directional optical sub-assembly. Chinese Journal of Engineering Design, 2019, 26(3): 299-304.

链接本文:

https://www.zjujournals.com/gcsjxb/CN/10.3785/j.issn.1006-754X.2019.03.008    或    https://www.zjujournals.com/gcsjxb/CN/Y2019/V26/I3/299

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