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双向光收发组件探测器端耦合和封装工艺分析 |
颜科, 张帆, 仲顺顺, 舒斌, 戚媛婧 |
中南大学 机电工程学院, 湖南 长沙 410083 |
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Analysis of coupling and packaging process for photodiode of bi-directional optical sub-assembly |
YAN Ke, ZHANG Fan, ZHONG Shun-shun, SHU Bin, QI Yuan-jing |
College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China |
引用本文:
颜科, 张帆, 仲顺顺, 舒斌, 戚媛婧. 双向光收发组件探测器端耦合和封装工艺分析[J]. 工程设计学报, 2019, 26(3): 299-304.
YAN Ke, ZHANG Fan, ZHONG Shun-shun, SHU Bin, QI Yuan-jing. Analysis of coupling and packaging process for photodiode of bi-directional optical sub-assembly. Chinese Journal of Engineering Design, 2019, 26(3): 299-304.
链接本文:
https://www.zjujournals.com/gcsjxb/CN/10.3785/j.issn.1006-754X.2019.03.008
或
https://www.zjujournals.com/gcsjxb/CN/Y2019/V26/I3/299
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