基于压电喷墨打印技术的多层电路垂直互连工艺研究

doi:10.3785/j.issn.1006-754X.2025.05.131

工程设计学报

2025, Vol. 32

Issue (6): 780-788 DOI: 10.3785/j.issn.1006-754X.2025.05.131

机械设计理论与方法

基于压电喷墨打印技术的多层电路垂直互连工艺研究

林枝城¹(

),加泽贤¹,苟宁²,孙岩辉¹(

),吕景祥¹,尹恩怀²,李超²

^1.长安大学道路施工技术与装备教育部重点实验室，陕西西安 710064
^2.西安瑞特三维科技有限公司，陕西西安 710068

Research on vertical interconnect process of multilayer circuits based on piezoelectric inkjet printing technology

Zhicheng LIN¹(

),Zexian JIA¹,Ning GOU²,Yanhui SUN¹(

),Jingxiang Lü¹,Enhuai YIN²,Chao LI²

^1.Key Laboratory of Road Construction Technology and Equipment of Ministry of Education, Chang'an University, Xi'an 710064, China
^2.Xi'an Ruite 3D Technology Co. , Ltd. , Xi'an 710068, China

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摘要：

为研究压电喷墨打印技术在多层电路垂直互连工艺中的应用，提出了垂直互连孔增减材复合成形工艺。该工艺分别使用钻削制孔与激光制孔两种技术制作互连电路的盲孔，并引入压电喷墨打印技术进行互连孔的精准填充，成功实现了双层及四层垂直互连电路的制造。实验结果表明：基于激光制孔方式形成的互连孔的孔壁呈倾斜状态，填充的纳米银油墨在固化后呈锥形分布，且孔内出现充填空洞；采用钻削制孔方式制作的互连孔的孔壁垂直度良好，填充的纳米银油墨在固化后与各层电路形成了紧密且均匀的连接，孔内无空洞、气孔等缺陷。实验所制备的互连样件均成功实现了各层电路的互连导通，且各层电路的电阻均值小于1.70 Ω。结合钻削制孔、激光制孔与压电喷墨打印技术的垂直互连孔增减材复合成形工艺，为多层电路的垂直互连提供了一种可行的解决方案。

关键词： 压电喷墨打印; 多层电路; 互连孔; 垂直互连; 增减材复合成形

Abstract:

To investigate the application of piezoelectric inkjet printing technology in vertical interconnect processes for multilayer circuits, a composite additive-subtractive forming process for vertical interconnection holes is proposed. This process employed mechanical drilling and laser drilling techniques to create blind holes in interconnection circuits, followed by precise filling of these holes using piezoelectric inkjet printing technology, successfully achieving the fabrication of double-layer and four-layer vertical interconnection circuits. The experimental results showed that the interconnection holes formed by the laser drilling technique exhibited inclined pore walls, with the cured nano-silver ink forming a conical distribution and voids appearing within the filled holes. In contrast, the interconnection holes fabricated by mechanical drilling technique maintained good perpendicularity of pore walls, enabling the cured nano-silver ink to form tight and uniform connections with each circuit layer, free of defects such as voids or pores. All fabricated interconnection samples successfully achieved electrical conductivity between each circuit layer, and the average resistance of each circuit layer was less than 1.70 Ω. The composite additive-subtractive forming process for vertical interconnection holes, which integrates mechanical drilling, laser drilling and piezoelectric inkjet printing technology, provides a viable solution for vertical interconnections between multilayer circuits.

Key words: piezoelectric inkjet printing multilayer circuits interconnection hole vertical interconnection composite additive-subtractive forming

收稿日期: 2025-04-14 出版日期: 2025-12-30

CLC:

TN 41

基金资助: 国家重点研发计划项目(2022YFB4602800)

通讯作者: 孙岩辉 E-mail: 2298946133@qq.com;yhsun@chd.edu.cn

作者简介: 林枝城（2000—），男，硕士生，从事增材制造研究，E-mail: 2298946133@qq.com

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引用本文:

林枝城,加泽贤,苟宁,孙岩辉,吕景祥,尹恩怀,李超. 基于压电喷墨打印技术的多层电路垂直互连工艺研究[J]. 工程设计学报, 2025, 32(6): 780-788.

Zhicheng LIN,Zexian JIA,Ning GOU,Yanhui SUN,Jingxiang Lü,Enhuai YIN,Chao LI. Research on vertical interconnect process of multilayer circuits based on piezoelectric inkjet printing technology[J]. Chinese Journal of Engineering Design, 2025, 32(6): 780-788.

链接本文:

https://www.zjujournals.com/gcsjxb/CN/10.3785/j.issn.1006-754X.2025.05.131 或 https://www.zjujournals.com/gcsjxb/CN/Y2025/V32/I6/780

图1 互连样件设计方案

图2 互连样件制作工艺流程

表1 打印参数

图3 双层互连样件的激光制孔效果

图4 四层互连样件的激光制孔效果

图5 互连样件的钻削制孔效果

图6 双层互连样件填孔效果

图7 互连样件上层导电线路打印及最终样件

图8 互连样件电阻测量结果

图9 激光制孔双层互连样件的镶样结果

图10 钻削制孔双层互连样件的镶样结果

图11 激光制孔四层互连样件的镶样结果

图12 钻削制孔四层互连样件的镶样结果

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