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Journal of Zhejiang University-SCIENCE A (Applied Physics & Engineering)  2009, Vol. 10 Issue (3): 458-463    DOI: 10.1631/jzus.A0820389
Energy and Chemical Engineering     
Morphology evolution of two-phase Cu-Ag alloys under different conditions
Jin-li HU, Jin-dong ZHANG, Liang MENG
Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China; Xingtai Xinhui Copper Special Wires Co. Ltd., Xingtai 055550, China
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Abstract  Cu-Ag filamentary microcomposites with different Ag contents were prepared by cold drawing and intermediate heat treatments. The microstructure characterization and filamentary distribution were observed for two-phase alloys under different conditions. The effect of heavy drawing strain on the microstructure evolution of Cu-Ag alloys was investigated. The results show that the microstructure components consist of Cu dendrites, eutectic colonies and secondary Ag precipitates in the alloys containing 6%~24% (mass fraction) Ag. With the increase in Ag content, the eutectic colonies in the microstructure increase and gradually change into a continuous net-like distribution. The Cu dendrites, eutectic colonies and secondary Ag precipitates are elongated in an axial direction and developed into the composite filamentary structure during cold drawing deformation. The eutectic colonies tend to evolve into filamentary bundles. The filamentary diameters decrease with the increase in drawing strain degree for the two-phase alloys, in particular for the alloys with low Ag content. The reduction in filamentary diameters becomes slow once the drawing strain has exceeded a certain level.

Key wordsCu-Ag alloy      Microstructure      Strain      Filamentary composite     
Received: 22 May 2008     
CLC:  TG143.6  
Cite this article:

Jin-li HU, Jin-dong ZHANG, Liang MENG. Morphology evolution of two-phase Cu-Ag alloys under different conditions. Journal of Zhejiang University-SCIENCE A (Applied Physics & Engineering), 2009, 10(3): 458-463.

URL:

http://www.zjujournals.com/xueshu/zjus-a/10.1631/jzus.A0820389     OR     http://www.zjujournals.com/xueshu/zjus-a/Y2009/V10/I3/458

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