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Journal of Zhejiang University-SCIENCE A (Applied Physics & Engineering)  2007, Vol. 8 Issue (3 ): 9-    DOI: 10.1631/jzus.2007.A0397
    
Finite element model analysis of thermal failure in connector
WANG Xin, XU Liang-jun
Research Lab of Electric Contacts, Beijing University of Posts & Telecommunications, Beijing 100876, China
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Abstract  Thermal analysis and thermal diagnose are important for small power connector especially in electronic devices since their structure is usually compact. In this paper thermal behavior of small power connector was investigated. It was found that the contact resistance increased due to the Joule heating, and that increased contact resistance produced more Joule heating; this mutual action causes the connector to lose efficiency. The thermal distribution in the connector was analyzed using finite element method (FEM). The failure mechanism is discussed. It provides basis for improving the structure. The conclusion was verified by experimental results.

Key wordsConnector      Stress relaxation      Finite element method (FEM)      Thermal failure     
Received: 19 December 2006     
CLC:  TB114.3  
  O224  
  O211.6  
Cite this article:

WANG Xin, XU Liang-jun. Finite element model analysis of thermal failure in connector. Journal of Zhejiang University-SCIENCE A (Applied Physics & Engineering), 2007, 8(3 ): 9-.

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http://www.zjujournals.com/xueshu/zjus-a/10.1631/jzus.2007.A0397     OR     http://www.zjujournals.com/xueshu/zjus-a/Y2007/V8/I3 /9

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