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Low temperature Si/Si wafer direct bonding using a plasma activated method |
Dong-ling Li, Zheng-guo Shang, Sheng-qiang Wang, Zhi-yu Wen |
National Key Laboratory of Fundamental Science of Novel Micro/Nano Device and System Technology, Chongqing University, Chongqing 400044, China; MOE Key Laboratory of Optoelectronic Technology & Systems, Chongqing University, Chongqing 400044, China; Microsystem Research Center, Chongqing University, Chongqing 400044, China |
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Low temperature Si/Si wafer direct bonding using a plasma activated method |
Dong-ling Li, Zheng-guo Shang, Sheng-qiang Wang, Zhi-yu Wen |
National Key Laboratory of Fundamental Science of Novel Micro/Nano Device and System Technology, Chongqing University, Chongqing 400044, China; MOE Key Laboratory of Optoelectronic Technology & Systems, Chongqing University, Chongqing 400044, China; Microsystem Research Center, Chongqing University, Chongqing 400044, China |
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