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Front. Inform. Technol. Electron. Eng.  2016, Vol. 17 Issue (1): 67-73    DOI: 10.1631/FITEE.1500167
    
Antenna-in-package system integrated with meander line antenna based on LTCC technology
School of Microelectronics, Xidian University, Xi’an 710071, China
Antenna-in-package system integrated with meander line antenna based on LTCC technology
Gang DONG(),Wei XIONG,Zhao-yao WU,Yin-tang YANG
School of Microelectronics, Xidian University, Xi’an 710071, China
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摘要：

We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic (LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module (MCM) for integration of integrated circuit (IC) bare chips. A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 dB, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mm × 6.1 mm × 2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.
Abstract:

We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic (LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module (MCM) for integration of integrated circuit (IC) bare chips. A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 dB, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mm × 6.1 mm × 2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.
Key words: Antenna-in-package (AiP)    Meander line antenna    Multi-chip module (MCM)    Low temperature co-fired ceramic (LTCC)
收稿日期: 2015-05-20 出版日期: 2016-01-05
CLC:  TN82  
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Parameter Value
Relative dielectric constant 5.9
Loss factor 0.2%
Thickness of each sheet 93 μm
Surface roughness < 0.25 μm
Thermal conductivity 2.0 W/(m·K)
  
  
  
  
  
  
  
  
  
  
  
Layer Thickness (mm)
Antenna 1.20
Internal ground 0.01
Packaging 1.40
  
  
  
  
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