Responsivity of photodiode directly affects the performance of the bi-directional optical sub-assembly (BOSA), and the coupling and packaging of the photodiode play an important role in production. In order to systematically analyze the influence of various offset factors of BOSA on the coupling of the photodiode, the photodiode current responsivity was selected as the coupling standard for experiment, and the improvement measures in the coupling and packaging process of the BOSA photodiode were obtained through the analysis of the experimental results. Referring to the actual optical path of BOSA, a fiber-filter-chip coupling model was established to simulate the relationship between beam offset and coupling efficiency. The offset generated in the BOSA coupling and packaging was studied and its effect on the coupling efficiency of the photodiode was analyzed. The coupling experiment was then performed on the BOSA photodiode using an automatic coupling device. The effects of the angular offset of filter, the height difference of filter-photodiode lens and the horizontal offset of photodiode lens on the coupling efficiency were analyzed. The experimental results showed that the horizontal offset of photodiode lens had the greatest influence on the coupling efficiency, and the angular offset of filter and the height difference of the filter-photodiode lens had little effect on the coupling efficiency. The research results provide systematic theoretical guidance for the coupling and packaging of BOSA photodiode, which has reference value for actual production.
YAN Ke, ZHANG Fan, ZHONG Shun-shun, SHU Bin, QI Yuan-jing. Analysis of coupling and packaging process for photodiode of bi-directional optical sub-assembly. Chinese Journal of Engineering Design, 2019, 26(3): 299-304.
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