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工程设计学报
工程设计学报  2008, Vol. 15 Issue (3): 198-200    
机电产品工程设计     
X射线测量板材厚度系统研究
 廖 平, 马洪秋, 陈 峰
中南大学 机电工程学院，湖南 长沙 410083
Research on technique of X-ray thickness gauge
 LIAO   Ping, MA  Hong-Qiu, CHEN   Feng
College of Mechanical and Electronical Engineering, Central South University, Changsha 410083, China
 全文: PDF(164 KB)   HTML
摘要： 传统测厚系统中采用工控机或PLC,数据处理慢,人机交互性差.针对这些缺点,对AT mega 16单片机在板材测厚仪上的应用进行研究,并比较了传统的以工控机为核心的电控系统与以AT mega 16单片机为电控核心的系统的优缺点.详细介绍了测厚仪电控系统的组成和原理,同时对基于Delphi的测厚数据的处理方法进行了说明.实践表明,该系统控制结构简单,有较高的运行效率和可靠性.
关键词： X射线;  测厚仪;  Delphi;  AVR    
Abstract: Conventional system of measuring thickness adopts industrial control computer or PLC, while its speed to process data is low and has poor human-machine interact capability. Aiming at these drawbacks, research on the application of AT mega 16 single chip on thickness gauge was conducted. Compare of the advantages and disadvantages of conventional electric control system taking industrial control computer as the kernel and system with AT mega 16 single chip as the electric control kernel was carried out. The composition and principle of electric control system of thickness gauge was introduced in details. Meantime, the measured thickness data process method based on Delphi was expounded. Practice indicates that control structure of this system is simple and it has high operating efficiency and reliability.
Key words: X-Ray    system of measuring thickness    Delphi    AVR
出版日期: 2008-06-28
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廖 平
马洪秋
陈 峰

引用本文:

廖 平, 马洪秋, 陈 峰. X射线测量板材厚度系统研究[J]. 工程设计学报, 2008, 15(3): 198-200.

LIAO Ping, MA Hong-Qiu, CHEN Feng. Research on technique of X-ray thickness gauge[J]. Chinese Journal of Engineering Design, 2008, 15(3): 198-200.

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https://www.zjujournals.com/gcsjxb/CN/    或    https://www.zjujournals.com/gcsjxb/CN/Y2008/V15/I3/198

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