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工程设计学报
工程设计学报  2019, Vol. 26 Issue (4): 477-483    DOI: 10.3785/j.issn.1006-754X.2019.04.014
通用零部件设计     
叶脉型微通道热沉设计及散热特性分析
谭慧1, 宗宽1, 熊长武1,2, 翁夏2, 杜平安1
1.电子科技大学 机械与电气工程学院， 四川 成都 611731
2.中国电子科技集团公司 第十研究所， 四川 成都610036
Design and heat transfer performance analysis of leaf vein-shaped microchannel heat sink
TAN Hui1, ZONG Kuan1, XIONG Chang-wu1,2, WENG Xia2, DU Ping-an1
1.School of Mechanical and Electrical Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
2.No.10 Research Institute, China Electronics Technology Group Corporation, Chengdu 610036, China
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摘要： 为改善相控阵天线多热源阵面温度的均匀性，基于植物叶脉优良的传质特性，提出一种用于相控阵多热源阵面的叶脉型微通道热沉。首先，对叶脉型微通道热沉的流动特性和散热特性进行仿真分析，得到热沉的热源温度分布。然后，以热源温度标准差最小化为目标，进一步优化叶脉型微通道结构，得到了非对称叶脉型微通道拓扑结构。最后，采用金属3D打印加工了铝基微通道热沉样件并进行散热性能测试。数值仿真结果表明，相比于传统平行微通道热沉，叶脉型微通道热沉不仅强化了传热，而且使得热源温度更均匀，压力损失更小；实验结果验证了叶脉型微通道热沉优良的散热性能。研究结论可为相控阵多热源阵面的热沉设计提供依据。
Abstract: In order to improve the temperature uniformity of phased array antenna with multiple sources, based on the excellent mass transfer characteristic of the plant leaf veins, a leaf vein-shaped microchannel heat sink for phased array antenna with multiple sources was proposed. Firstly, the temperature distribution of heat sources in heat sink was displayed through the simulation analysis of flow and heat transfer performance of the leaf vein-shaped microchannel heat sink. Then, the structure of leaf vein-shaped microchannel was optimized by minimizing the standard deviation of heat source temperature, and an asymmetry leaf vein-shaped microchannel topology structure was achieved. Lastly, the test piece of aluminum-based microchannel heat sink was made by metal 3D printing and its heat transfer performance was tested. The numerical simulation results indicated that compared with the traditional parallel microchannel heat sink, the leaf vein-shaped microchannel heat sink not only enhanced heat transfer, but also made the heat source temperature more uniform and pressure loss smaller. The experimental results verified the excellent heat transfer performance of leaf vein-shaped microchannel heat sink. The research conclusion can provide basis for the heat sink design of phased array antenna with multiple sources.
收稿日期: 2019-04-17 出版日期: 2019-08-28
CLC:  TB 131  
基金资助: 国防基础科研计划重点项目(JCKY2013210B004)
通讯作者: 杜平安(1962—)，男，四川成都人，教授，博士生导师，博士，从事多物理场数值仿真技术研究，E-mail: dupingan@uestc.edu.cn，https://orcid.org/0000-0002-3571-7912     E-mail: dupingan@uestc.edu.cn
作者简介: 谭慧(1986—)，女，山东临沂人，博士生，从事微通道散热技术研究，E-mail:tanhui1986@aliyun.com，https://orcid.org/0000-0002-0736-8874
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引用本文:

谭慧, 宗宽, 熊长武, 翁夏, 杜平安. 叶脉型微通道热沉设计及散热特性分析[J]. 工程设计学报, 2019, 26(4): 477-483.

TAN Hui, ZONG Kuan, XIONG Chang-wu, WENG Xia, DU Ping-an. Design and heat transfer performance analysis of leaf vein-shaped microchannel heat sink. Chinese Journal of Engineering Design, 2019, 26(4): 477-483.

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https://www.zjujournals.com/gcsjxb/CN/10.3785/j.issn.1006-754X.2019.04.014    或    https://www.zjujournals.com/gcsjxb/CN/Y2019/V26/I4/477

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