引用本文:

孙衍人 林言方 陈华平. 提高硅光电探测器树脂封装可靠性研究[J]. 浙江大学学报（理学版）, .

Sun Yanren Ling Yanfang Cheng Huaping. enhancement of resin package reliability on silicon photodetector. Journal of ZheJIang University(Science Edition), .

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http://www.zjujournals.com/sci/CN/    或    http://www.zjujournals.com/sci/CN/Y1989/V16/I2/168