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Front. Inform. Technol. Electron. Eng.  2016, Vol. 17 Issue (1): 74-82    DOI: 10.1631/FITEE.1500114
    
Improving the efficiency of magnetic coupling energy transfer by etching fractal patterns in the shielding metals*
1School of Aerospace, Tsinghua University, Beijing 100084, China
2National Engineering Laboratory for Neuromodulation, Beijing 100084, China
3Center of Epilepsy, Beijing Institute for Brain Disorders, Beijing 100084, China
Improving the efficiency of magnetic coupling energy transfer by etching fractal patterns in the shielding metals*
Qing-feng LI1,2,?(),Shao-bo CHEN1,2,Wei-ming WANG1,2,Hong-wei HAO1,2,Lu-ming LI1,2,3,?()
1School of Aerospace, Tsinghua University, Beijing 100084, China
2National Engineering Laboratory for Neuromodulation, Beijing 100084, China
3Center of Epilepsy, Beijing Institute for Brain Disorders, Beijing 100084, China
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摘要:

Thin metal sheets are often located in the coupling paths of magnetic coupling energy transfer (MCET) systems. Eddy currents in the metals reduce the energy transfer efficiency and can even present safety risks. This paper describes the use of etched fractal patterns in the metals to suppress the eddy currents and improve the efficiency. Simulation and experimental results show that this approach is very effective. The fractal patterns should satisfy three features, namely, breaking the metal edge, etching in the high-intensity magnetic field region, and etching through the metal in the thickness direction. Different fractal patterns lead to different results. By altering the eddy current distribution, the fractal pattern slots reduce the eddy current losses when the metals show resistance effects and suppress the induced magnetic field in the metals when the metals show inductance effects. Fractal pattern slots in multilayer high conductivity metals (e.g., Cu) reduce the induced magnetic field intensity significantly. Furthermore, transfer power, transfer efficiency, receiving efficiency, and eddy current losses all increase with the increase of the number of etched layers. These results can benefit MCET by efficient energy transfer and safe use in metal shielded equipment.

Abstract:

Thin metal sheets are often located in the coupling paths of magnetic coupling energy transfer (MCET) systems. Eddy currents in the metals reduce the energy transfer efficiency and can even present safety risks. This paper describes the use of etched fractal patterns in the metals to suppress the eddy currents and improve the efficiency. Simulation and experimental results show that this approach is very effective. The fractal patterns should satisfy three features, namely, breaking the metal edge, etching in the high-intensity magnetic field region, and etching through the metal in the thickness direction. Different fractal patterns lead to different results. By altering the eddy current distribution, the fractal pattern slots reduce the eddy current losses when the metals show resistance effects and suppress the induced magnetic field in the metals when the metals show inductance effects. Fractal pattern slots in multilayer high conductivity metals (e.g., Cu) reduce the induced magnetic field intensity significantly. Furthermore, transfer power, transfer efficiency, receiving efficiency, and eddy current losses all increase with the increase of the number of etched layers. These results can benefit MCET by efficient energy transfer and safe use in metal shielded equipment.

Key words: Fractal pattern    Metal-layer-shield    Eddy current    Magnetic coupling energy transfer
收稿日期: 2015-04-09 出版日期: 2016-01-05
CLC:  TN992  
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Scheme PE(%) PT(%) η(%) PT/PTR(%) Slots length(mm) Suppression efficiency(%/mm)
Fig. 4a 10.1 98.7 92.8 88.0 245.66 0.366
Fig. 4b 23.9 96.6 84.1 74.7 280.88 0.271
Fig. 4c 13.3 98.2 90.7 84.3 140.00 0.619
Fig. 4d 11.5 98.4 91.8 86.7 247.50 0.357
Fig. 4e 4.0 99.6 97.1 95.2 489.25 0.196
Fig. 4f 16.6 97.5 88.5 81.9 125.00 0.667
Fig. 4g 6.5 99.1 95.3 92.8 292.50 0.320
Fig. 4h 3.5 99.6 97.4 96.4 635.00 0.152
No slot 100.0 81.8 51.1 38.6 Null Null
No metal Null 100.0 100.0 100.0 Null Null
  
  
  
Scheme PE(%) PT (%) η(%) PT/PTR (%)
No copper 100.0 100.0 100.0 100.0
No slot 88.1 34.2 44.3 50.0
Etching one layer 99.9 46.0 53.7 56.3
Etching two layers 103.7 94.0 94.0 93.8
  
  
  
  
Scheme PE(%) PT (%) η(%) PT/PTR (%)
Fig. 9a 0 100.0 100.0 100.0
Fig. 9b 100.0 64.7 20.6 8.7
Fig. 9c 79.0 75.2 27.9 12.4
Fig. 9d 6.7 95.8 86.2 72.0
  
  
  
  
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