基于压电喷墨打印技术的多层电路垂直互连工艺研究
Research on vertical interconnect process of multilayer circuits based on piezoelectric inkjet printing technology
基于压电喷墨打印技术的多层电路垂直互连工艺研究 |
| 林枝城,加泽贤,苟宁,孙岩辉,吕景祥,尹恩怀,李超 |
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Research on vertical interconnect process of multilayer circuits based on piezoelectric inkjet printing technology |
| Zhicheng LIN,Zexian JIA,Ning GOU,Yanhui SUN,Jingxiang LÜ,Enhuai YIN,Chao LI |
| 图9 激光制孔双层互连样件的镶样结果 |
| Fig.9 Inlaid results of double-layer interconnection sample with laser drilling |
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