基于压电喷墨打印技术的多层电路垂直互连工艺研究

林枝城,加泽贤,苟宁,孙岩辉,吕景祥,尹恩怀,李超

Research on vertical interconnect process of multilayer circuits based on piezoelectric inkjet printing technology

Zhicheng LIN,Zexian JIA,Ning GOU,Yanhui SUN,Jingxiang LÜ,Enhuai YIN,Chao LI

图7 互连样件上层导电线路打印及最终样件

Fig.7 Conductive line printing on the upper layer of interconnection samples and final samples