工程设计理论、方法与技术 |
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非接触搭接结构电磁屏蔽特性的数值分析 |
滑晓飞, 杜平安, 曹钟, 聂宝林 |
电子科技大学 机械电子工程学院, 四川 成都 611731 |
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Numerical analysis on the electromagnetic shielding properties of non-contact overlapped joints |
HUA Xiao-Fei, DU Ping-An, CAO Zhong, NIE Bao-Lin |
School of Mechatronics Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China |
引用本文:
滑晓飞, 杜平安, 曹钟, 聂宝林. 非接触搭接结构电磁屏蔽特性的数值分析[J]. 工程设计学报, 2013, 20(4): 315-320.
HUA Xiao-Fei, DU Ping-An, CAO Zhong, NIE Bao-Lin. Numerical analysis on the electromagnetic shielding properties of non-contact overlapped joints. Chinese Journal of Engineering Design, 2013, 20(4): 315-320.
链接本文:
https://www.zjujournals.com/gcsjxb/CN/
或
https://www.zjujournals.com/gcsjxb/CN/Y2013/V20/I4/315
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