基于单颗磨粒划切试验的SiCp/Al复合材料表面去除机理研究
Surface removal mechanism study of SiCp/Al composites based on single-point cutting test
基于单颗磨粒划切试验的SiCp/Al复合材料表面去除机理研究 |
| 张红哲,张旭,朱晓春,鲍永杰 |
|
Surface removal mechanism study of SiCp/Al composites based on single-point cutting test |
| Hong-zhe ZHANG,Xu ZHANG,Xiao-chun ZHU,Yong-jie BAO |
| 图 7 SiCp/Al复合材料中碳化硅颗粒二次切削过程仿真 |
| Fig.7 Simulation of secondary cutting process of SiC particles in SiCp/Al composites |
|
|