基于单颗磨粒划切试验的SiCp/Al复合材料表面去除机理研究
Surface removal mechanism study of SiCp/Al composites based on single-point cutting test
基于单颗磨粒划切试验的SiCp/Al复合材料表面去除机理研究 |
| 张红哲,张旭,朱晓春,鲍永杰 |
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Surface removal mechanism study of SiCp/Al composites based on single-point cutting test |
| Hong-zhe ZHANG,Xu ZHANG,Xiao-chun ZHU,Yong-jie BAO |
| 图 2 符合实际磨削加工参数范围的单颗磨粒划切试验装置与方法 |
| Fig.2 Experimental device and method of single-point cutting test in accordance with actual grinding parameters |
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