面向可重构制造的数字孪生映射建模与监控仿真

冷柏寒,夏唐斌,孙贺,王皓,奚立峰

Digital twin mapping modeling and method of monitoring and simulation for reconfigurable manufacturing system

Bo-han LENG,Tang-bin XIA,He SUN,Hao WANG,Li-feng XI

表 2 4种规划构型仿真结果

Tab.2 Simulation result of four planned configurations

仿真构型 $ C_{{\text{Rec}}}^\prime $构成 $ C_{{\text{Rec}}}^\prime $/CNY ${T_{{\text{Bat}}}}$/s ${\text{Bal}}$/% 当前构型 − − 518.1 51.3 规划构型① ${\text{PI} }({M^{\rm{F}}}) + P({\text{Base} })$ 280 000 476.4 63.0 规划构型② ${\text{PI} }({M^{\rm{F}}}) + {\text{PI} }({M^{{\rm{A}}/{\rm{G}}} }) + 2P({\text{Base} })$ 420 000 449.9 63.0 规划构型③ ${\text{PI} }({M^{\rm{F}}}) + {\text{PI} }({M^{{\rm{A}}/{\rm{G}}} }) + 2P({\text{Base} })$ 420 000 451.6 63.0 规划构型④ ${\text{PI} }({M^{\rm{F}}}) + {\text{PI} }({M^{\rm{E}}}) + {\text{PI} }({M^{{\rm{A}}/{\rm{G}}} }) + 3P({\text{Base} })$ 820 000 419.9 77.4