芯片键合纵弯复合超声换能器的设计与试验
Design and experiment of longitudinal-flexural composite ultrasonic transducer for chip bonding
芯片键合纵弯复合超声换能器的设计与试验 |
| 胡广豪,薛进学,马文举,隆志力 |
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Design and experiment of longitudinal-flexural composite ultrasonic transducer for chip bonding |
| Guang-hao HU,Jin-xue XUE,Wen-ju MA,Zhi-li LONG |
| 图 8 谐响应分析时振幅随频率的变化曲线 |
| Fig.8 Amplitude at different frequencies in harmonic response |
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