芯片键合纵弯复合超声换能器的设计与试验

胡广豪,薛进学,马文举,隆志力

Design and experiment of longitudinal-flexural composite ultrasonic transducer for chip bonding

Guang-hao HU,Jin-xue XUE,Wen-ju MA,Zhi-li LONG

图 6 弯振模态位移振型

Fig.6 Flexural displacement mode of transducer