芯片键合纵弯复合超声换能器的设计与试验
Design and experiment of longitudinal-flexural composite ultrasonic transducer for chip bonding
芯片键合纵弯复合超声换能器的设计与试验 |
| 胡广豪,薛进学,马文举,隆志力 |
|
Design and experiment of longitudinal-flexural composite ultrasonic transducer for chip bonding |
| Guang-hao HU,Jin-xue XUE,Wen-ju MA,Zhi-li LONG |
| 图 11 纵弯换能器的振动测试平台 |
| Fig.11 Vibration testing platform for longitudinal-flexural composite transducer |
|
|